3M EMI/RFI Management Solutions

3M EMI/RFI Management Solutions protect systems from EMI and RFI, ensuring efficient and reliable communication. Electromagnetic interference (EMI) - also known as radio frequency interference (RFI) - is generated by electronic devices, communication signals, electromagnetic frequencies, and static electricity, interfering with the performance of electronic components. These 3M EMI/RFI management solutions are designed for boosting signal-to-noise ratios in electronics, improving antenna signal integrity and even grounding displays for connected and smart products. When the noise level rises higher than the signal's strength, resulting in a low signal-to-noise ratio (SNR), it can degrade electronic performance, causing errors, data loss, delayed or incorrect readings, or temporary shutdowns that can result in critical situations.

Features

EMI Absorbing
- Absorbing capabilities up to 6GHz with targeted permeability
- Absorbing performance is thickness-dependent
- Improved antenna performance and reduced EMI interference
- Multiple thickness options for diverse applications
- Supplied on a removable liner for easy handling
- Halogen-free products available

EMI Shielding and Grounding
- XYZ-axis or Z-axis conductivity
- Excellent electrical resistance for small contact areas
- High adhesion for reliable contact to various substrates
- Great handling and workability
- Great EMI shielding in bond line gap
- Multiple levels of adhesion, conformability, and flexibility
- Broad range of thicknesses for different gap sizes

Applications

EMI Shielding and Grounding
- Shielding display wrap
- Flex circuit to flex circuit interconnection
- Shield can lid
- Sensor grounding
- Display chip on flex
- PCB/flex/chassis grounding
- Electrostatic Discharge (ESD)
- EMI shield and gasket attachment
- FPC grounding
- Bond line gap shielding
- PIM management

EMI Absorbing
- Cable wrapping/attachment
- Attached to noise (traces, ICs, reflective enclosure surfaces)
- Attached to metal surfaces (reduce emitting EMI noise)
- Bond line gap shielding
- Attached to Semicon chip/microprocessors
- Insert between module (compartment)