LBWA1KL1FX-875

Murata Electronics
81-LBWA1KL1FX-875
LBWA1KL1FX-875

製造商:

說明:
多協議模組 Type 1FX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 8.2

壽命週期:
NRND:
不建議用於新設計。
ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 63

庫存:
63 可立即送貨
工廠前置作業時間:
46 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$401.88 NT$401.88
NT$349.18 NT$3,491.80
NT$330.90 NT$8,272.50
NT$305.80 NT$30,580.00
NT$289.31 NT$72,327.50
NT$279.99 NT$139,995.00
完整捲(訂購多個1000)
NT$268.52 NT$268,520.00

商品屬性 屬性值 選擇屬性
Murata
產品類型: 多協議模組
RoHS:  
1FX
2.4 GHz
17 dBm
SDIO
3.35 V
4.2 V
- 30 C
+ 70 C
External
6.95 mm x 5.15 mm x 1.1 mm
802.11 b/g/n
Reel
Cut Tape
品牌: Murata Electronics
數據率: 11 Mb/s, 54 Mb/s, 65 Mb/s
調製技術: CCK, DSSS, OFDM
濕度敏感: Yes
工作電源電壓: 3.6 V
產品類型: Multiprotocol Modules
原廠包裝數量: 1000
子類別: Wireless & RF Modules
電源電流接收: 60 mA
電源電流傳輸: 370 mA
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

合規守則
CNHTS:
8517629990
CAHTS:
8517620090
USHTS:
8517620090
TARIC:
8517620000
ECCN:
5A992.C
原產地分類
原產國:
中國
封裝原產國:
無資料
擴散國:
無資料
出貨時,國家可能會有所變更。

Automotive Connectivity Modules

Murata Electronics Automotive Connectivity Modules provide a platform for connecting and networking devices, equipment, and processes. These wireless connectivity platforms uniquely assist OEM design engineers, application developers, and systems integrators in accelerating the development and delivery of public or private cloud networking solutions to automotive, consumer, commercial, and industrial customers.

Wireless Modules & Software

Murata Electronics Wireless Modules and Software provide solutions for wearable computing, intelligent homes, smart vehicles, digital health and fitness, machine-to-machine (M2M) commercial, and industrial applications. These complete solutions from Murata that combine sensors, wireless technology, and software to help build infrastructure for the Internet of Things (IoT). Through its wireless connectivity platforms, Murata continuously innovates how to connect and network devices, equipment, and processes to fully achieve IoT. Murata Electronics Wireless Modules and Software are available in a wide variety of connectivity solutions to meet the current and future needs of designers.

Wireless Ecosystem

Wireless technologies like Wi-Fi® for wireless local area networks (WLAN), BLUETOOTH® technology for content streaming, and Bluetooth low energy technology for ultra-low-power connectivity form the backbone of IoT. Infineon Technologies seamlessly integrates all these technologies to provide state-of-the-art, interoperable solutions for consumer, industrial, medical, automotive, and other applications. Infineon’s wireless technology is built from intellectual property (IP) deployed in all mainstream application segments and meets the industry specifications. These technologies can be found in the modules through the various partners below, as well as associated various SOCs. Time to market can be accelerated using one of the many wireless products from Infineon Technologies below.

Wi-Fi® Modules & Wi-Fi+BLUETOOTH® Modules

Murata Wi-Fi® Modules and Wi-Fi+BLUETOOTH® Modules allow users to connect to the internet directly, providing flexible wireless technology for IoT products. This wide portfolio of Wi-Fi modules supports IEEE 802.11a, 11b, 11g, and 11ac 2x2 MIMO standard, 2.4GHz and 5GHz band for wireless LAN, and Bluetooth 4.1/4.2/5.0/5.1 BR/EDR/LE communication. The interface for the host processor is SDIO or PCIe for high-throughput applications with radio-only modules and UART with MCU-embedded modules for lower data rate applications. The interface for Murata Bluetooth is UART.