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ATS-1038-C4-R0

Name: Advanced Thermal Solutions ATS-1038-C4-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-1038-C4-R0
Price: 544.56 TWD
Availability: OutOfStock

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請參閱產品規格

Mouser 編號：

984-ATS-1038-C4-R0

製造商編號：

ATS-1038-C4-R0

製造商：

Advanced Thermal Solutions

說明：

散熱器 maxiFLOW BGA Heat Sink+Plastic pushPIN, High Performance, Cross-Cut, 40x38x10mm

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

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庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 8 週工廠預計生產時間。

輸入數量：

最少： 100 多個： 100

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$544.56	NT$54,456.00
	NT$533.09	NT$266,545.00
1,000	報價

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商品屬性	屬性值	選擇屬性
製造商:	Advanced Thermal Solutions
產品類型:	散熱器
RoHS:
產品:	Heat Sinks
設計目的:	BGA
長度:	40 mm
寬度:	38 mm
高度:	10 mm
品牌:	Advanced Thermal Solutions
色彩:	Green
封裝:	Bulk
產品類型:	Heat Sinks
系列:	maxiFLOW XCut PushPIN
原廠包裝數量:	100
子類別:	Heat Sinks
公司名稱:	maxiFLOW pushPIN
類型:	Component

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所選屬性: 0

合規守則

CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

原產地分類

原產國:: 中國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

maxiFLOW™ Cross-Cut Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.