ATS-59000-C1-R0

Advanced Thermal Solutions
984-ATS-59000-C1-R0
ATS-59000-C1-R0

製造商：

說明：
散熱器 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 21x45x9mm

規格書:
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庫存：
暫無庫存
工廠前置作業時間：
13 週 工廠預計生產時間。
最少： 100   多個： 100
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$1,020.00 NT$102,000.00
NT$994.16 NT$198,832.00
500 報價

商品屬性 屬性值 選擇屬性
Advanced Thermal Solutions
產品類型: 散熱器
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
6.1 C/W
45 mm
21 mm
9 mm
品牌: Advanced Thermal Solutions
色彩: Black
封裝: Bulk
產品類型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
原廠包裝數量: 100
子類別: Heat Sinks
公司名稱: maxiFLOW maxiGRIP
類型: Component
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所選屬性: 0

規格書

Test/Quality Data

此功能需要啟用JavaScript。

CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Heat Sinks

Advanced Thermal Solutions Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW™, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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