ATS-59009-C1-R0

Advanced Thermal Solutions
984-ATS-59009-C1-R0
ATS-59009-C1-R0

製造商：

說明：
散熱器 maxiGRIP Heat Sink Assembly, 2 Side Adhesive, T412, 42.5mm Comp, 62x52x13mm

規格書:
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庫存：
暫無庫存
工廠前置作業時間：
13 週 工廠預計生產時間。
最少： 100   多個： 100
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$746.64 NT$74,664.00
NT$733.38 NT$146,676.00
NT$726.58 NT$363,290.00
1,000 報價

商品屬性 屬性值 選擇屬性
Advanced Thermal Solutions
產品類型: 散熱器
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
3.2 C/W
62 mm
52 mm
13 mm
品牌: Advanced Thermal Solutions
色彩: Black
封裝: Bulk
產品類型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
原廠包裝數量: 100
子類別: Heat Sinks
公司名稱: maxiFLOW maxiGRIP
類型: Component
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所選屬性: 0

規格書

Test/Quality Data

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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