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560-003-000-211

Name: EDAC 560-003-000-211
Brand: EDAC
SKU: 587-560-003-000-211
Price: 30.26 TWD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

587-560-003-000-211

製造商編號：

560-003-000-211

製造商：

EDAC

說明：

管腳和插座連接器 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 3 contact spaces, female, white, Wire Insulation oe1.30 to oe1.70

規格書:

560-003-000-211 規格書 (PDF)

ECAD模型:

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更多資訊

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庫存量: 329

庫存：: 329 可立即送貨

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 4 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$30.26	NT$30.26
	NT$26.11	NT$261.10
	NT$23.87	NT$596.75
	NT$22.17	NT$2,217.00
	NT$20.20	NT$5,050.00
	NT$15.33	NT$7,665.00
	NT$14.86	NT$59,440.00
	NT$14.45	NT$115,600.00

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商品屬性	屬性值	選擇屬性
製造商:	EDAC
產品類型:	管腳和插座連接器
RoHS:
產品:	Receptacle Housings
定位數:	3 Position
排數:	1 Row
間距:	2.5 mm
終端類型:	Crimp
安裝風格:	Free Hanging
外殼材料:	Silicon Rubber
額定電壓:	250 V
系列:	560
品牌:	EDAC
產品類型:	Pin & Socket Connectors
原廠包裝數量:	500
子類別:	Pin & Socket Connectors
每件重量:	1 g

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所選屬性: 0

篩選文檔:

CNHTS:: 8538900000
CAHTS:: 8536690040
USHTS:: 8538908180
JPHTS:: 853890000
KRHTS:: 8536699000
TARIC:: 8536699099
BRHTS:: 85366990
ECCN:: EAR99

Medical Interconnect Solutions

EDAC offers a comprehensive range of connectors and cable assemblies designed for medical applications. Featured products include card edge connectors for signal and power delivery in blood analyzers, header connectors for facilitating multi-board solutions, in-line connectors for ensuring reliable wire-to-wire and wire-to-board connections, and rugged in-line, D-Sub, USB, and HDMI connectors for IP-rated protection. The IP-rated connectors are EMI-shielded and prevent dust, debris, and moisture ingress, which enhances patient care and diagnostic accuracy while meeting stringent regulatory standards. These EDAC connectors and cable assemblies are ideal medical interconnect solutions, such as ambulances, medical rooms, ventilators, and CPAP machines.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.