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637-M15-230-BN5

Name: EDAC 637-M15-230-BN5
Brand: EDAC
SKU: 587-637-M15-230-BN5
Price: 159.46 TWD
Availability: InStock

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Mouser 編號：

587-637-M15-230-BN5

製造商編號：

637-M15-230-BN5

製造商：

EDAC

說明：

D-Sub標準連接器 637M Series vertical D-Sub plug connector, 15 machined pin type contacts, PCB tail length 5.90mm, #4-40 UNC threaded standoffs

規格書:

637-M15-230-BN5 規格書 (PDF)

ECAD模型:

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更多資訊

瞭解更多關於EDAC 637-M15-230-BN5的資訊

庫存量: 39

庫存：: 39 可立即送貨

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輸入數量：

最少： 1 多個： 1

單價:

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總價:

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估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$159.46	NT$159.46
	NT$145.18	NT$1,451.80
	NT$137.36	NT$2,747.20
	NT$120.02	NT$6,001.00
	NT$105.06	NT$10,506.00
	NT$100.30	NT$20,060.00
	NT$96.90	NT$48,450.00
	NT$88.40	NT$88,400.00
	NT$85.68	NT$171,360.00

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商品屬性	屬性值	選擇屬性
製造商:	EDAC
產品類型:	D-Sub標準連接器
REACH - SVHC:
定位數:	15 Position
聯繫人性別:	Pin (Male)
終端類型:	Solder Tail
安裝風格:	Flange Mount
裝配角:	Vertical
排數:	3 Row
性別:	Pin
觸點电镀:	Gold
類型:	Plug
外殼質料:	Steel
外殼板:	Nickel
系列:	637M
板鎖:	With Boardlocks
品牌:	EDAC
觸點材料:	Copper Alloy
觸點類型:	Machined Contacts
额定电流:	5 A
絕緣材料:	Polyamide (PA)
最高工作溫度:	+ 125 C
最低工作溫度:	- 55 C
間距:	2.29 mm
產品類型:	D-Sub Connectors - Standard Density
原廠包裝數量:	100
子類別:	D-Sub Connectors

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Medical Interconnect Solutions

EDAC offers a comprehensive range of connectors and cable assemblies designed for medical applications. Featured products include card edge connectors for signal and power delivery in blood analyzers, header connectors for facilitating multi-board solutions, in-line connectors for ensuring reliable wire-to-wire and wire-to-board connections, and rugged in-line, D-Sub, USB, and HDMI connectors for IP-rated protection. The IP-rated connectors are EMI-shielded and prevent dust, debris, and moisture ingress, which enhances patient care and diagnostic accuracy while meeting stringent regulatory standards. These EDAC connectors and cable assemblies are ideal medical interconnect solutions, such as ambulances, medical rooms, ventilators, and CPAP machines.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.