MCL1005-3R6-R

Eaton Electronics
504-MCL1005-3R6-R
MCL1005-3R6-R

製造商：

說明：
RF電感器 - SMD MCL Chip IND 1005 3.6nH 2 Pads

規格書:
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庫存：
暫無庫存
工廠前置作業時間：
12 週 工廠預計生產時間。
最少： 1   多個： 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$3.40 NT$3.40
NT$0.612 NT$6.12
NT$0.544 NT$54.40
NT$0.442 NT$442.00
NT$0.374 NT$1,870.00
完整捲（訂購多個10000）
NT$0.306 NT$3,060.00

類似產品

商品屬性 屬性值 選擇屬性
Eaton
產品類型: RF電感器 - SMD
RoHS:  
3.6 nH
1 mm
0.5 mm
0.5 mm
MCL
Reel
Cut Tape
應用: High Frequency
品牌: Eaton Electronics
外殼代碼 - in: 0402
外殼代碼 - mm: 1005
安裝風格: PCB Mount
產品: RF Inductors
產品類型: RF Inductors - Leaded
原廠包裝數量: 10000
子類別: Inductors, Chokes & Coils
終端類型: SMD/SMT
每件重量: 1 mg
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所選屬性: 0

規格書

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CNHTS:
8504500000
USHTS:
8504508000
TARIC:
8504509590
ECCN:
EAR99

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

MCL Multilayer Chip Inductors

Eaton Electronics MCL Multilayer Chip Inductors feature multilayer monolithic construction for high reliability and are suitable for wave and reflow soldering. These inductors are available in three variants: MCL1005, MCL1608V1, and MCL2012V1. The MCL1005 inductors offer high self-resonant frequency (SRF) and a 1nH to 360nH inductance range. The MCL1608V1 inductors operate at a 0.47µH to 12µH inductance range, and the MCL2012V1 inductors have a 0.047uH to 22uH inductance range. Eaton MCL Multilayer Chip Inductors are moisture sensitivity level (MSL) 1. Typical applications include industrial connectivity, wireless communications, wearable devices, broadband components, and RF transceiver modules.

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