D01-9900601

Harwin
855-D01-9900601
D01-9900601

製造商:

說明:
IC 及元件插座 6P OF H3153-01 SKT ON CARRIER COMB

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 555

庫存:
555 可立即送貨
工廠前置作業時間:
8 週 工廠預計生產時間數量大於所顯示的數量。
數量超過555會受到最小訂單要求的限制。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$100.64 NT$100.64
NT$91.46 NT$914.60
NT$86.36 NT$4,318.00
NT$80.24 NT$8,024.00
NT$70.38 NT$17,595.00
NT$63.92 NT$31,960.00
NT$59.50 NT$59,500.00
NT$55.76 NT$139,400.00
NT$53.04 NT$265,200.00

商品屬性 屬性值 選擇屬性
Harwin
產品類型: IC 及元件插座
RoHS:  
REACH - SVHC:
DIP / SIP Sockets
6 Position
1 Row
Sub-Miniature Socket
1.27 mm
Solder Pin
Tin
- 55 C
+ 100 C
D01
品牌: Harwin
安裝風格: SMD/SMT
產品類型: IC & Component Sockets
原廠包裝數量: 50
子類別: IC & Component Sockets
每件重量: 290 mg
找到產品:
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至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

I.C. D01/D2 Sockets & Socket Strips

Harwin I.C. D01/D2 Sockets and Socket Strips consist of round-pin and wire-wrap I.C. sockets designed to accommodate integrated circuits and other components with connection pins. The machined female contacts have a gold-plated contact finish and are housed in glass-filled thermoplastic for robust insulation and mechanical strength. Tin-plated termination surfaces are designed for through-hole solder and wire-wrap terminations. Harwin I.C. D01/D2 Sockets and Socket Strips are suitable for various electronics, including consumer and automotive, and industrial equipment.

Industrial Solutions

Harwin provides a wide range of industrial solutions that are compatible with industry-standard connector systems. These products are certified to EN9100D/AS9100D, ensuring continual improvement and quality management systems. Included in the available Industrial Solutions are durable industrial connectors, PCB connectors, spring contacts, EMC shielding, PCB sockets, and PCB hardware. Harwin Industrial Solutions are ideal for industrial and factory equipment, data collection, mobile maintenance and display control systems, portable test equipment, and base station communications.