223794-0201

Molex
538-223794-0201
223794-0201

製造商:

說明:
集管和線殼 MICRO-FIT+ HSG 01X02P

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 32,471

庫存:
32,471 可立即送貨
工廠前置作業時間:
29 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$15.98 NT$15.98
NT$13.60 NT$136.00
NT$11.56 NT$1,156.00
NT$10.34 NT$2,585.00
NT$9.83 NT$9,830.00
NT$8.57 NT$21,425.00
NT$8.09 NT$161,800.00

商品屬性 屬性值 選擇屬性
Molex
產品類型: 集管和線殼
RoHS:  
Wire Housings
Plug Housing
2 Position
3 mm (0.118 in)
1 Row
Panel Mount
Crimp
223794
Micro-Fit+
Power
- 40 C
+ 105 C
Bulk
品牌: Molex
易燃性等級: UL 94V-0
外殼顏色: Black
插座類型: Plug
外殼材料: Nylon
產品類型: Headers & Wire Housings
原廠包裝數量: 1
子類別: Headers & Wire Housings
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8547200000
USHTS:
8538908180
JPHTS:
853890000
ECCN:
EAR99

Glow Wire Micro-Fit+ Connectors

Molex Glow Wire Micro-Fit+ Connectors offer a 3mm pitch, a high current rating of 13A, and are glow wire capable. These connectors feature fully isolated contacts on each side of the interface to help prevent potential arcing, a unique keying design to prevent mismating, and a small PCB footprint that provides design flexibility. The surface-mount technology (SMT) and through-hole technology (THT) headers offer flexibility in PCB designs, with clip and nail SMT options available for improved strength and reliability. Molex Glow Wire Micro-Fit+ Connectors are suitable for various environments, including consumer, medical, automotive, sustainable energy, and telecommunications.

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.