似乎你已停用瀏覽器的JavaScript。除非你登入，否則此頁面上的某些功能將無法使用。

HDTM-3-06-1-S-VT-5-R-2

Name: Samtec HDTM-3-06-1-S-VT-5-R-2
Brand: Samtec
SKU: 200-HDTM3061SVT5R2
Price: 353.94 TWD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-HDTM3061SVT5R2

製造商編號：

HDTM-3-06-1-S-VT-5-R-2

製造商：

Samtec

說明：

高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

規格書:

HDTM-3-06-1-S-VT-5-R-2 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Samtec HDTM-3-06-1-S-VT-5-R-2的資訊

庫存量: 38

庫存：: 38 可立即送貨

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 1 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$353.94	NT$353.94
	NT$319.26	NT$3,192.60
	NT$284.24	NT$7,106.00
	NT$232.22	NT$22,293.12
	NT$208.42	NT$60,024.96
	NT$192.78	NT$101,787.84
	NT$173.06	NT$174,444.48
	NT$153.34	NT$309,133.44

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	高速/模組連接器
RoHS:
產品:	Headers
定位數:	36 Position
排數:	6 Row
間距:	1.8 mm
終端類型:	Press Fit
觸點电镀:	Gold
封裝:	Tray
品牌:	Samtec
產品類型:	High Speed / Modular Connectors
原廠包裝數量:	48
子類別:	Backplane Connectors

找到產品:

若要顯示類似商品，請選取至少一個核選方塊

至少選中以上一個核取方塊以顯示在此類別中類似的產品。

所選屬性: 0

篩選文檔:

規格書

HDTM-3-06-1-S-VT-5-R-2 規格書 (PDF)

Images

圖像

Specification Sheets

Technical Resources

Test Report (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.