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430446-503

Name: Tark Thermal Solutions 430446-503
Brand: Tark Thermal Solutions
SKU: 739-430446-503
Price: 1247.46 TWD
Availability: InStock

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Mouser 編號：

739-430446-503

製造商編號：

430446-503

製造商：

Tark Thermal Solutions

說明：

熱電珀耳帖模塊 Thermoelectric Cooler, Ceramic Plate, for High Current, RTV, 21.7W, 25x25x3.1mm

規格書:

430446-503 規格書 (PDF)

ECAD模型:

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庫存量: 422

庫存：: 422 可立即送貨

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工廠前置作業時間：: 12 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

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總價:

NT$-.--

估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$1,247.46	NT$1,247.46
	NT$1,140.02	NT$5,700.10
	NT$1,106.36	NT$11,063.60
	NT$1,059.10	NT$25,418.40
	NT$1,019.66	NT$48,943.68
	NT$1,015.92	NT$121,910.40
	NT$991.44	NT$214,151.04

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商品屬性	屬性值	選擇屬性
製造商:	Tark Thermal Solutions
產品類型:	熱電珀耳帖模塊
RoHS:
產品類型:	Thermoelectric Peltier Modules
類型:	Ceramic Plate
Qmax:	21.7 W
最大溫差:	+ 70.5 C
最大電流:	2.6 A
最大電壓:	13.9 V
長度:	25 mm
寬度:	25 mm
高度:	3.1 mm
最高工作溫度:	+ 80 C
品牌:	Tark Thermal Solutions
導線長度:	114.3 mm
產品:	Thermoelectric Coolers
系列:	CP
原廠包裝數量:	24
子類別:	Thermoelectric
終端類型:	Wire Leads
零件號別名:	CP08-127-05-L1-RT-W4.5 CP08,127,05,L1,RT,W4.5 CP08-127-05-L1-RT-W4.5 CP08-127-05-L1-RT
每件重量:	17.501 g

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所選屬性: 0

                        
Laird Thermal Systems is now Tark Thermal Solutions.

Please contact a Mouser Technical Sales Representative for
further information.

5-0525-3

篩選文檔:

規格書

430446-503 規格書 (PDF)

CNHTS:: 8541500001
USHTS:: 8418690180
TARIC:: 8419508090
ECCN:: EAR99

CP Series Ceramic Plate Thermoelectric Coolers

Tark CP (Ceramic Plate) Thermoelectric Modules feature high-performance, highly reliable TEMs in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. These components are constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics. The CP Thermoelectric modules offer precise temperature control and reliable solid-state operation. These TEMs are designed for higher current and large heat-pumping applications. Typical applications include thermoelectric coolers for handheld cosmetic lasers, cooling for centrifuges, and peltier cooling for machine vision.

CP Thermoelectric Modules w/ Sealant - EXPANSION

Laird has expanded its CP Series to include Thermoelectric Modules with Epoxy and RT sealants. The Epoxy version features a low-density syntactic foam epoxy encapsulant with a temperature range of -55°C to 150°C and the RT version has a non-corrosive, silicone adhesive sealant with a temperature range of -60°C to 204°C. Known as 'the standard' in the thermoelectric industry, the Laird CP Series consists of high-performance and highly reliable Thermoelectric Modules (TEMs) available in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. Constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics, the Laird Technologies CP Series Thermoelectric Modules feature precise temperature control and reliable solid state operation. Designed for higher current and large heat-pumping applications, the Laird CP Series TEMs are ideally suited for applications such as medical lasers, lab science instrumentation, clinical diagnostic systems, photonics laser systems, electronic enclosure cooling, food and beverage cooling, and chillers (liquid cooling). RoHS Compliant and environmentally friendly.

熱電冷卻器 (TCS)

Tark Thermal Solutions Thermoelectric Coolers (TECs) are solid-state heat pumps that require a heat exchanger to dissipate heat utilizing the Peltier effect. During operation, Direct Current (DC) flows through the thermoelectric cooler to create heat transfer and a temperature differential across the ceramic substrates. This process causes one of the coolers to be cold and the other side to be hot. The Thermoelectric Coolers can be used as a power generator to convert waste heat into usable output DC power. These coolers are available in 2mm x 2mm to 62mm x 62mm dimensions. The TECs are ideal for applications that require precise temperature control, high reliability, low weight, and compact geometry constraints. Typical applications include medical diagnostics, medical imaging, battery cooling, automotive, aerospace defense, and optoelectronics.