904-27-1-12-2-B-0

Wakefield Thermal
567-904-27-1-12-2-B
904-27-1-12-2-B-0

製造商:

說明:
散熱器 Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 212

庫存:
212 可立即送貨
工廠前置作業時間:
16 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$288.66 NT$288.66
NT$273.70 NT$2,737.00
NT$258.40 NT$6,460.00
NT$243.10 NT$12,155.00
NT$228.14 NT$22,814.00
NT$214.54 NT$64,362.00
NT$206.72 NT$124,032.00
NT$199.24 NT$239,088.00

商品屬性 屬性值 選擇屬性
Wakefield Thermal
產品類型: 散熱器
RoHS:  
Heat Sink Assemblies
Component, 27mm
Clip
Aluminum
Pin Fin
27 mm
27 mm
11.6 mm
品牌: Wakefield Thermal
色彩: Black
產品類型: Heat Sinks
系列: 900
原廠包裝數量: 300
子類別: Heat Sinks
類型: Component
每件重量: 10 g
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所選屬性: 0

CNHTS:
8548000090
USHTS:
8473302000
ECCN:
EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.