54132-4062

Molex
538-54132-4062
54132-4062

製造商:

說明:
FFC和FPC連接器 0.5 FPC Hsg AssyBtmW /AuPlt40CktEmbsTpPk

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 17,070

庫存:
17,070 可立即送貨
工廠前置作業時間:
23 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
包裝:
完整捲(訂購多個1500)

Pricing (TWD)

數量 單價
總價
零卷 / MouseReel™
NT$73.44 NT$73.44
NT$62.56 NT$625.60
NT$56.10 NT$1,402.50
NT$53.38 NT$5,338.00
NT$49.98 NT$12,495.00
NT$47.60 NT$23,800.00
NT$44.20 NT$44,200.00
完整捲(訂購多個1500)
NT$41.82 NT$62,730.00
NT$40.46 NT$121,380.00
† NT$215.00 MouseReel™費用將加入您的購物車內並自動計算。所有MouseReel™訂單均不能取消和不能退換。

商品屬性 屬性值 選擇屬性
Molex
產品類型: FFC和FPC連接器
RoHS:  
Board Mount
40 Position
0.5 mm
SMD/SMT
Right Angle
Bottom Contact
Gold
500 mA
54132
- 20 C
+ 85 C
Reel
Cut Tape
MouseReel
刺激類型: ZIF
品牌: Molex
易燃性等級: UL 94 V-0
外殼顏色: Black, Natural
外殼材料: Thermoplastic (TP)
產品類型: FFC & FPC Connectors
原廠包裝數量: 1500
子類別: FFC & FPC Connectors
額定電壓: 50 V
零件號別名: 0541324062
每件重量: 448.760 mg
找到產品:
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所選屬性: 0

CNHTS:
8536901100
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders

Molex Easy-On FFC/FPC Connectors 0.50/1mm Pitch Sliders Series feature a market-proven slider locking mechanism and wide circuit options in top, bottom, and vertical contact variations. The wide circuits offer design flexibility for FF/FPC cable routing applications. The miniature FFC/FPC SMT connectors are designed to meet a wide variety of space and application-specific needs. The Sn-Ag-Bi plating reduces and/or prevents the production of tin whiskers, increasing the reliability of the associated parts. These Molex Easy-On connectors offer a compact size for applications with tight packaging requirements. The robust actuator design helps prevent damage caused by extensive testing, cycling, or rough handling. Zero Insertion Force (ZIF) and LIF options enable repeat cycling with minimum wear. Available in a variety of fine-pitch options, the lower-profile and higher-density features meet the downsizing needs of electronic equipment makers.