S7101-42R

SMT彈簧接點

Harwin SMT彈簧接點可靈活建立電氣和接地連接。這些彈簧接點具有多種配置和工作高度，在空間有限的情況下提供理想的解決方案。它們非常適合盲插，並且能夠耐受擦拭和滑動動作。該接點以帶狀與卷狀形式提供，以實現自動化組裝和經濟高效的生產。Harwin SMT彈簧接點具有多種配置，可提供諸多優勢。天線觸點具有正向停止功能，可防止元件過度受壓和永久固定。多向接觸允許垂直或水平使用。盒式設計可防止自由端扭曲和纏繞，而C形設計則能與金屬屏蔽或框架實現簡單有效的接觸。                  

Harwin EZ-Shield Fingers

Harwin RFI Shield Fingers can be assembled to PCBs and used as grounding or shielding contacts, in contact with metal frames or shields. Suitable for both wiping and sliding action, the individual clips are ideal for automated placement.
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EZ-BoardWare RFI & SMT PCB Hardware

Harwin EZ-BoardWare RFI and SMT PCB Hardware products are all designed to simplify PCB production processes. The portfolio includes spring contacts, shield cans, shield can clips, coin cell holders, test points, and more. Harwin EZ-BoardWare RFI and SMT PCB Hardware products increase design flexibility and cost effectiveness.

Industrial Solutions

Harwin provides a wide range of industrial solutions that are compatible with industry-standard connector systems. These products are certified to EN9100D/AS9100D, ensuring continual improvement and quality management systems. Included in the available Industrial Solutions are durable industrial connectors, PCB connectors, spring contacts, EMC shielding, PCB sockets, and PCB hardware. Harwin Industrial Solutions are ideal for industrial and factory equipment, data collection, mobile maintenance and display control systems, portable test equipment, and base station communications.

EMC Shielding Solutions

Harwin EMC Shielding Solutions include a range of surface-mount shield clips, compatible shield cans, and spring contacts to solve a variety of EMI/RFI and grounding issues. The SMT components are provided on tape and reel for automated assembly and lowered production costs. Shield cans and clips eliminate the need for manual soldering, simplifying production and increasing reliability. Harwin spring contacts prevent RFI noise and allow for design flexibility when an electrical or grounding connection is needed.