F3L200R07W2S5FB11BOMA1

Infineon Technologies
726-F3L20R07W2S5FB11
F3L200R07W2S5FB11BOMA1

製造商:

說明:
IGBT 模組 650 V, 200 A 3-level IGBT module

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10 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
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此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$3,100.46 NT$3,100.46
NT$2,517.70 NT$25,177.00

商品屬性 屬性值 選擇屬性
Infineon
產品類型: IGBT 模組
RoHS:  
SiC IGBT Modules
3-Phase Inverter
650 V
1.17 V
200 A
100 nA
- 40 C
+ 150 C
Tray
品牌: Infineon Technologies
產品類型: IGBT Modules
系列: Trenchstop IGBT5
原廠包裝數量: 15
子類別: IGBTs
技術: Si
公司名稱: EasyPACK
零件號別名: F3L200R07W2S5F_B11 SP003597026
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CNHTS:
8504409100
USHTS:
8541290065
TARIC:
8541290000
ECCN:
EAR99

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

F3L200R07W2S5FP EasyPACK™ IGBT Modules

Infineon Technologies F3L200R07W2S5FP EasyPACK™ IGBT Modules feature up to 650V increased blocking voltage capability and employ CoolSiC™ Schottky diode (gen5). These devices are based on TRENCHSTOP™ IGBT5  and PressFIT contact technology. The F3L200R07W2S5FP IGBT modules provide strongly reduced switching losses and an Al2O3 substrate with low thermal resistance. These modules come with a compact design comprising rugged mounting due to integrated mounting clamps and pre-applied thermal interface material. The F3L200R07W2S5FP IGBT modules are ideal for motor drives, solar applications, 3-level applications, and UPS systems.  

Reliable & Efficient Power Supply for Data Centers

Infineon Technologies Reliable and Efficient Power Supply for Data Centers are scalable solutions with power ratings from approximately 5kW to 50/60kW. This Infineon solution is ideal for uninterruptible power supplies (UPS) that require high power density and energy efficiency. These modules leverage various chip technologies, including Si IGBT, CoolSiC™ hybrid, and CoolSiC MOSFET, to meet diverse requirements for cost-effectiveness and performance. Infineon's portfolio addresses all system levels of a UPS with different voltage classes, and are set to expand offerings to include lower power rating classes.

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