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TD190N16SOFHPSA2

Name: Infineon TD190N16SOFHPSA2
Brand: Infineon Technologies
SKU: 726-TD190N16SOFHPSA2
Price: 1781.26 TWD
Availability: OutOfStock

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Mouser 編號：

726-TD190N16SOFHPSA2

製造商編號：

TD190N16SOFHPSA2

製造商：

Infineon Technologies

說明：

離散半導體模組 L#T-BOND MODULE

規格書:

TD190N16SOFHPSA2 規格書 (PDF)

ECAD模型:

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在途量:: 16

預期2026/2/20
工廠前置作業時間：: 24

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

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總價:

NT$-.--

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Pricing (TWD)

數量	單價	總價
	NT$1,781.26	NT$1,781.26
	NT$1,288.94	NT$10,311.52
	NT$1,283.84	NT$133,519.36

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	離散半導體模組
RoHS:
產品:	Thyristor-Diode Modules
類型:	Phase Control
技術:	Si
Vr - 反向電壓:	1.6 kV
安裝風格:	Screw Mount
封裝/外殼:	PB34
最低工作溫度:	- 40 C
最高工作溫度:	+ 125 C
封裝:	Tray
品牌:	Infineon Technologies
配置:	SCR/Diode Phase Control
閘極觸發器電流 - Igt:	145 mA
保持電流 Ih 最大:	200 mA
Id - C連續漏極電流:	30 mA
產品類型:	Discrete Semiconductor Modules
原廠包裝數量:	8
子類別:	Discrete and Power Modules
標準延遲時間:	2 us
標準斷開延遲時間:	320 us
零件號別名:	TD190N16SOF SP001206284
每件重量:	165 g

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篩選文檔:

規格書

TD190N16SOFHPSA2 規格書 (PDF)

Application Notes

Product Catalogs

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CNHTS:: 8504901900
USHTS:: 8541300080
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.