似乎你已停用瀏覽器的JavaScript。除非你登入，否則此頁面上的某些功能將無法使用。

TT160N16SOFHPSA1

Name: Infineon TT160N16SOFHPSA1
Brand: Infineon Technologies
SKU: 726-TT160N16SOFHPSA1
Price: 1748.28 TWD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

726-TT160N16SOFHPSA1

製造商編號：

TT160N16SOFHPSA1

製造商：

Infineon Technologies

說明：

單晶閘管模組 L#T-BOND MODULE

規格書:

TT160N16SOFHPSA1 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Infineon Technologies TT160N16SOFHPSA1的資訊

庫存量: 3

庫存：: 3 可立即送貨

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 24 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

此產品免費航運

Pricing (TWD)

數量	單價	總價
	NT$1,748.28	NT$1,748.28
	NT$1,263.78	NT$10,110.24
	NT$1,254.94	NT$130,513.76

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	單晶閘管模組
RoHS:
閘極觸發器電流 - Igt:	145 mA
最低工作溫度:	- 40 C
最高工作溫度:	+ 125 C
安裝風格:	Screw Mount
封裝:	Tray
品牌:	Infineon Technologies
保持電流 Ih 最大:	200 mA
產品類型:	Thyristor Modules
原廠包裝數量:	8
子類別:	Discrete and Power Modules
技術:	Si
類型:	Thyristor
零件號別名:	TT160N16SOF SP001495450
每件重量:	165 g

找到產品:

若要顯示類似商品，請選取至少一個核選方塊

至少選中以上一個核取方塊以顯示在此類別中類似的產品。

所選屬性: 0

篩選文檔:

規格書

TT160N16SOFHPSA1 規格書 (PDF)

EOL

Product Discontinuation Notification (PDF)

Product Catalogs

此功能需要啟用JavaScript。

CNHTS:: 8504409190
CAHTS:: 8541300000
USHTS:: 8541300080
JPHTS:: 854130000
TARIC:: 8541300000
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.