CYW20736ET

Infineon Technologies
727-CYW20736ET
CYW20736ET

製造商:

說明:
RF微控制器- MCU Bluetooth BLE and IEEE 802.15.4

壽命週期:
NRND:
不建議用於新設計。
ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
暫無庫存
工廠前置作業時間:
14 週 工廠預計生產時間。
最少: 2500   多個: 2500
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
完整捲(訂購多個2500)
NT$450.84 NT$1,127,100.00

商品屬性 屬性值 選擇屬性
Infineon
產品類型: RF微控制器- MCU
RoHS:  
Reel
品牌: Infineon Technologies
濕度敏感: Yes
產品類型: RF Microcontrollers - MCU
系列: CYW20736
原廠包裝數量: 2500
子類別: Wireless & RF Integrated Circuits
技術: Si
找到產品:
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所選屬性: 0

CNHTS:
8542310000
CAHTS:
8542310000
USHTS:
8542310030
MXHTS:
8542310302
ECCN:
5A992.C

CYW20736 BLUETOOTH® Low Energy SoC

Infineon Technologies CYW20736 BLUETOOTH® Low Energy SoC features a 200nA power-down current, 3.63V input signal range, and 2402MHz to 2480MHz frequency range. The CYW20736 supports the entire spectrum of Bluetooth Smart use cases for medical, home automation, accessory, sensor, Internet of Things (IoT), and wearable market segments. The CYW20736 Bluetooth Low Energy SoC is a monolithic component implemented in a standard digital CMOS process and requires minimal external components to make a fully compliant Bluetooth device. The Infineon CYW20736 is available in a 32-pin, 5mm × 5mm 32-QFN package and WLCSP and die packages.

AIROC™ BLUETOOTH® & BLUETOOTH LE SoCs

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE SoCs enable the capability to compute at the edge for various IoT applications. The devices feature integrated flash with analog and digital components, allowing for easy interfacing with external components.

CYW207xx RF System on a Chip

Infineon Technologies CYW207xx RF Systems on a Chip provides a high level of integration for wearables and other consumer/industrial embedded applications. The devices include integrated PMU, IEEE 802.11 MAC/baseband, radio, and BLUETOOTH® for each combo chip. The chips support all rates specified in the IEEE 802.11a/b/g/n/ac specifications. The CYW207xx also supports optional antenna diversity for improved RF performance in difficult environments.