IT18 COM-HPC®薄型BGA夾層式連接器

Hirose Electric IT18 COM-HPC^® Low-Profile BGA Mezzanine Connectors are advanced mezzanine connectors for next-generation COM-HPC embedded computing. These Hirose connectors offer stacking heights of 5mm and 10mm with an open pin field, providing designers with layout flexibility. A BGA pin-in-ball structure enhances mounting reliability, making the IT18 series ideal for embedded computing, servers, industrial automation, and medical imaging systems where space-saving, high-speed connectivity is critical.