C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

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數量 RoHS ECAD模型 產品
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排數
行距
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封裝
Molex 集管和線殼 2.54MM CGRIDIII HDR 12P R/A DR SEL AU
規格書
213庫存量
最少： 1
倍數： 1

Headers Breakaway 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90122 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HSG 5P SR W/2POL BTTN
規格書
4,156庫存量
最少： 1
倍數： 1

Wire Housings Receptacle Housing 5 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex 集管和線殼 2.54MM CGRIDIII HSG 8P SR W/2POL BTTN
規格書
2,580庫存量
最少： 1
倍數： 1

Wire Housings Receptacle Housing 8 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex 集管和線殼 2.54MM CGRIDIII HSG 9P SR W/2POL BTTN
規格書
677庫存量
最少： 1
倍數： 1

Wire Housings Receptacle Housing 9 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex 集管和線殼 2.54MM CGRIDIII HSG 25P SR W/2POL BTTN
規格書
490庫存量
最少： 1
倍數： 1

Wire Housings Receptacle Housing 25 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex 集管和線殼 2.54MM CGRIDIII HDR 12P V DR SHRD TIN
規格書
36庫存量
8,304在途量
最少： 1
倍數： 1

Headers Shrouded 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 18P V DR SHRD TIN
規格書
841庫存量
最少： 1
倍數： 1

Headers Shrouded 18 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 26P V DR SHRD TIN
規格書
180庫存量
2,880預期2026/6/1
最少： 1
倍數： 1

Headers Shrouded 26 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 34P V DR SHRD TIN
規格書
226庫存量
最少： 1
倍數： 1

Headers Shrouded 34 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 18CKT VERT DR HDR SHROUDED
規格書
204庫存量
最少： 1
倍數： 1

Headers Shrouded 18 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 HDR 2X03P RA SHRD FULLY LOADED
規格書
1,093庫存量
最少： 1
倍數： 1

Headers Shrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 HDR DUAL R/A 10P shrouded fully load
規格書
668庫存量
3,360預期2026/4/27
最少： 1
倍數： 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 14P R/A DR SHRD TIN
規格書
384庫存量
最少： 1
倍數： 1

Headers Shrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 16P R/A DR SHRD TIN
規格書
843庫存量
最少： 1
倍數： 1

Headers Shrouded 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 24P R/A DR SHRD TIN
規格書
320庫存量
最少： 1
倍數： 1

Headers Shrouded 24 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 26P R/A DR SHRD TIN
規格書
74庫存量
2,880預期2026/5/14
最少： 1
倍數： 1

Headers Shrouded 26 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 HDR DUAL R/A 10P
規格書
552庫存量
2,688預期2026/8/24
最少： 1
倍數： 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 12P R/A DR SHRD AU
規格書
353庫存量
1,440預期2026/4/30
最少： 1
倍數： 1

Headers Shrouded 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 C-Grid Shrd Hdr DR R Hdr DR RA Au-F 14/14
規格書
657庫存量
最少： 1
倍數： 1

Headers Shrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 C-Grid DR Vt Pn 6.75 .75/2.90mm Tn-A 2Ckt
規格書
2,619庫存量
最少： 1
倍數： 1

Headers Breakaway 2 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 6P VERT DR TIN
規格書
1,596庫存量
4,800預期2026/5/6
最少： 1
倍數： 1

Headers Breakaway 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 10P VERT DR TIN
規格書
2,244庫存量
5,307預期2026/6/29
最少： 1
倍數： 1

Headers Breakaway 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 12P VERT DR TIN
規格書
360庫存量
最少： 1
倍數： 1

Headers Breakaway 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 14P VERT DR TIN
規格書
794庫存量
最少： 1
倍數： 1

Headers Breakaway 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 集管和線殼 2.54MM CGRIDIII HDR 20P VERT DR TIN
規格書
70庫存量
最少： 1
倍數： 1

Headers Breakaway 20 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90131 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray