NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

結果: 34
選擇 圖像 零件編號
 製造商
說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 產品
定位數
間距
排數
終端類型
裝配角
堆疊高度
额定电流
額定電壓
最高數據率
最低工作溫度
最高工作溫度
觸點电镀
觸點材料
外殼材料
系列
封裝
Amphenol TCS 板對板及夾層連接器 200P NeXLev Plug Solder Balls
規格書
暫無庫存
最少： 24
倍數： 24

Plugs 200 Position 1.15 mm (0.045 in) BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS 板對板及夾層連接器 200P NeXLev Recept Leaded Solder Balls
規格書
無庫存前置作業時間 26 週
最少： 24
倍數： 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 17 mm, 20 mm, 25 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS 板對板及夾層連接器 200P NeXLev Recept Solder Balls
規格書
暫無庫存
最少： 24
倍數： 24

Plugs 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 17 mm, 20 mm, 25 mm, 30 mm, 33 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev
Amphenol TCS 板對板及夾層連接器 300P NeXLev Plug 570 Solder Balls
規格書
暫無庫存
最少： 20
倍數： 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS 板對板及夾層連接器 300P NeXLev Plug Solder Balls
規格書
暫無庫存
最少： 20
倍數： 20

Plugs 300 Position 1.15 mm (0.045 in) BGA Vertical 10 mm, 13 mm, 18 mm, 23 mm, 26 mm 1 A 600 V 12.5 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray

Amphenol TCS 板對板及夾層連接器 300P NeXLev Plug 570 Solder Balls
規格書
無庫存前置作業時間 26 週
最少： 20
倍數： 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 12 mm, 15 mm, 20 mm, 25 mm, 28 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev

Amphenol TCS 板對板及夾層連接器 300P NeXLev Plug 570 Solder Balls
規格書
暫無庫存
最少： 20
倍數： 20

Plugs 300 Position 30 Row Solder Vertical 6.5 mm NeXLev
Amphenol TCS 板對板及夾層連接器 300P NeXLev Plug Solder Balls
規格書
暫無庫存
最少： 20
倍數： 20

Plugs 300 Position 1.15 mm (0.045 in) 30 Row BGA Vertical 14 mm, 17 mm, 22 mm, 27 mm, 30 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Tray
Amphenol TCS 板對板及夾層連接器 200P NeXLev Recept 380 Solder Balls
規格書
暫無庫存
最少： 24
倍數： 24

Receptacles 200 Position 1.15 mm (0.045 in) 20 Row BGA Vertical 10 mm, 12 mm, 14 mm, 17 mm 1 A 600 V - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) NeXLev Bulk