DLP5533AAFYSQ1

Texas Instruments
595-DLP5533AAFYSQ1
DLP5533AAFYSQ1

製造商:

說明:
顯示器驅動器和控制器 DLP® automotive 0.55-inch digital mi

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庫存:
暫無庫存
工廠前置作業時間:
18 週 工廠預計生產時間。
最少: 165   多個: 165
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$4,730.08 NT$780,463.20
330 報價

商品屬性 屬性值 選擇屬性
Texas Instruments
產品類型: 顯示器驅動器和控制器
RoHS:  
DLP5533A
DMD Controllers
DMD
- 40 C
+ 105 C
SMD/SMT
CPGA-149
Tray
品牌: Texas Instruments
運作供電電流: 300 mA
Pd - 功率消耗 : 796.6 mW
產品類型: Display Drivers & Controllers
原廠包裝數量: 33
子類別: Driver ICs
電源電壓 - 最大值: 2.3 V
電源電壓 - 最小值: - 500 mV
公司名稱: DLP
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所選屬性: 0

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USHTS:
8542390090
ECCN:
EAR99

DLP® Devices

Texas Instruments DLP® technology enables innovative optical solutions that disrupt existing end equipment and create new markets. The DLP chip, or Digital Micromirror Device (DMD), is an array of micromirrors that can be used for high-speed, efficient, and reliable spatial light modulation. Not only a leader in consumer projection, but DLP is also redefining industrial, medical, telecom, security, and many other applications. This technology helps customers reduce design cycles and deliver disruptive products.

DLP5533A-Q1 DLP Automotive DMD

Texas Instruments DLP5533A-Q1 DLP Automotive Digital Micromirror Device (DMD) is combined with the DLPC230-Q1 DMD controller and TPS99001-Q1 system management and illumination controller. This combination provides the capability to achieve high-performance high-resolution headlight systems. The 2:1 aspect ratio supports very wide aspect ratio designs, and the 1.3MP resolution enables high-resolution symbol projection and adaptive driving beam applications. The DLP5533A-Q1 has more than three times the optical throughput of the preceding DLP3030-Q1 automotive DMD, enabling an even larger field of view and higher lumens output. The Texas Instruments DLP5533A-Q1 automotive DMD micromirror array is configured for bottom illumination, which enables highly efficient and more compact optical engine designs. The S450 package has low thermal resistance to the DMD array to enable more efficient thermal solutions.