OMAP5910 Dual-Core Applications Processor

Texas Instruments OMAP5910 Dual-Core Applications Processor is a highly integrated hardware and software platform designed to meet the application processing needs of next-generation embedded devices. The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture benefits DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core. The Texas Instruments OMAP5910 is designed to run leading open and embedded RISC-based operating systems and the Texas Instruments (TI) DSP/BIOS™ software kernel foundation. The device is available in a 289-ball MicroStar BGA package.

結果: 4
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Texas Instruments 數位訊號處理器及控制器 - DSP、DSC Applications process or 289-NFBGA -40 to 1,430庫存量
最少: 1
倍數: 1
DSPs ARM9TDMI, C55x 2 Core 150 MHz NFBGA-289 16 kB 192 kB 16 kB 8 kB 1.6 V OMAP5910 SMD/SMT - 40 C + 85 C Tray
Texas Instruments 數位訊號處理器及控制器 - DSP、DSC Applications Proc R 595-XDM3730CUS R 595-XDM3730CUS 19庫存量
最少: 1
倍數: 1
DSPs ARM9TDMI, C55x 2 Core 150 MHz BGA-289 16 kB 352 kB 16 kB, 24 kB 8 kB, 160 kB 1.6 V OMAP5910 OMAP SMD/SMT - 40 C + 85 C Tray
Texas Instruments 數位訊號處理器及控制器 - DSP、DSC Applications process or 289-NFBGA -40 to 10庫存量
最少: 1
倍數: 1

DSPs ARM9TDMI, C55x 2 Core 150 MHz NFBGA-289 16 kB 192 kB 16 kB 8 kB 1.6 V OMAP5910 SMD/SMT - 40 C + 85 C Tray
Texas Instruments 數位訊號處理器及控制器 - DSP、DSC Application Processr R 595-XDM3730CUS R 595-XDM3730CUS 無庫存前置作業時間 18 週
最少: 84
倍數: 84

DSPs ARM9TDMI, C55x 2 Core 150 MHz BGA-289 352 kB 16 kB, 24 kB 8 kB, 160 kB 1.6 V OMAP5910 OMAP SMD/SMT - 40 C + 85 C Tray