i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.

結果: 15
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 類型 核心 操作頻率 最低工作溫度 最高工作溫度 封裝
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 1,128庫存量
最少: 1
倍數: 1

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 414庫存量
最少: 1
倍數: 1

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 807庫存量
最少: 1
倍數: 1

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 1
倍數: 1

ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 1,200
倍數: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 1,200
倍數: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 1,200
倍數: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 1,200
倍數: 1,200
SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications 無庫存前置作業時間 16 週
最少: 630
倍數: 630

SOC ARM Cortex A35 800 MHz - 40 C + 85 C Tray