ChipConnect Internal Cable Assemblies

TE Connectivity's ChipConnect Internal Faceplate-to-Processor Cable Assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor. The assemblies connect with Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25Gbps speeds. 

結果: 2
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 連接器A端 連接器A端針腳數 連接器B端 連接器B端針腳數 電纜長度 性別
TE Connectivity / AMP 專用線纜 IFP B/INV LEC STR CBL ASSY 1PORT 160MM 無庫存前置作業時間 12 週
最少: 100
倍數: 100

Power Cables Receptacle 54 Position Plug 28 Position 160 mm Male / Female
TE Connectivity 專用線纜 IFP A/INV LEC STR CBL ASSY 2PORT 208MM 無庫存前置作業時間 17 週
最少: 100
倍數: 100

Power Cables Plug 54 Position Plug 28 Position 208 mm Male / Male