MIKROE-3764

Mikroe
932-MIKROE-3764
MIKROE-3764

製造商:

說明:
磁感測器開發工具 3D Hall 6 Click

庫存量: 4

庫存:
4 可立即送貨
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$1,421.88 NT$1,421.88

商品屬性 屬性值 選擇屬性
Mikroe
產品類型: 磁感測器開發工具
RoHS:  
Add-On Boards
Magnetic Sensor
MLX90380
3.3 V
品牌: Mikroe
尺寸: 42.9 mm x 25.4 mm
接口類型: SPI
產品類型: Magnetic Sensor Development Tools
系列: 3D Hall
原廠包裝數量: 1
子類別: Development Tools
公司名稱: mikroBUS
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所選屬性: 0

CAHTS:
8473302000
USHTS:
8473301180
MXHTS:
8473300401
ECCN:
EAR99

MIKROE-3629 3D Hall 7 Click Board

Mikroe MIKROE-3629 3D Hall 7 Click Board is a magnetic field sensing Click board used to measure the intensity of the magnetic field across three perpendicular axes. This Mikroe click board is equipped with AK09970N high-sensitivity 3D magnetic sensor IC. The mikroSDK-compliant library supports the MIKROE-3629 and can be readily used on a system equipped with a mikroBUS™ socket. This click board utilizes SPI and I2C interfaces with the help of onboard jumpers for communication interface selection. This is done as the SPI and I2C lines are multiplexed on the same pins due to the very low pin count of the magnetic sensor. The MIKROE-3629 is ideal for position sensing, contactless knobs, encoders, switches, and potentiometers.

Sensor Click Boards

Mikroe Sensor Click Boards enable the addition of various sensors to applications and designs. Click boards™ are based around the mikroBUS™ interface standard and easily add incredible capabilities to systems. Mikroe Sensor Click Boards are ideal for any application that requires custom sensor capability. 

Click Board™

MikroElektronika MikroBUS™ Adapter click boards™的設計可讓使用者以革命性的方式為開發板新增功能。使用者可將Click Board插入創新的MikroBUS™標準插槽,無需進行硬體設定即可開始使用。MikroElektronika mikroBUS™ Adapter Click Board的類別包括無線通訊模組、有線通信模組、感測器模組及其他模組與配件。

3D Hall 6 Click

Mikroe 3D Hall 6 Click is a magnetic field sensing board that measures the intensity of a magnetic field across three perpendicular axes. The Mikroe board features the Melexis MLX90380 monolithic contactless sensor IC. This IC is sensitive to the flux density applied orthogonally and parallel to the IC surface. Each axis has a separate Hall sensing element for accurate and reliable measurements in a 3D space. The 3D Hall 6 click supports the SPI communication protocol for communicating with the main MCU.