TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

結果: 15
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說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS 產品
類型
合金
封裝類型
Chip Quik 焊料 Paste No-Clean 15g Sn63/Pb37 T4
規格書
212庫存量
255預期2026/2/25
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 35g Sn63/Pb37 T4
規格書
134庫存量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 250g Sn63/Pb37 T4
規格書
36庫存量
41預期2026/3/5
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste No-Clean 50g Sn63/Pb37 T4
規格書
148庫存量
247預期2026/2/16
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
規格書
261庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
規格書
93庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
規格書
45庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
規格書
206庫存量
1預期2026/2/9
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
規格書
93庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
規格書
65庫存量
167預期2026/3/2
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
規格書
272庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste No-Clean 500g Sn63/Pb37 T4
規格書
9庫存量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik 焊料 Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
規格書
57庫存量
104預期2026/2/23
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
規格書
無庫存前置作業時間 6 週
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik 焊料 Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
規格書
N/A
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge