TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

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說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS 產品
類型
合金
封裝類型
Chip Quik 焊料 Paste No-Clean 15g Sn63/Pb37 T4
規格書
566庫存量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 35g Sn63/Pb37 T4
規格書
157庫存量
324在途量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 50g Sn63/Pb37 T4
規格書
373庫存量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
規格書
156庫存量
294預期2026/7/13
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
規格書
71庫存量
123預期2026/7/10
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
規格書
33庫存量
54預期2026/7/15
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
規格書
135庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
規格書
175庫存量
40預期2026/6/15
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
規格書
92庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
規格書
193庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
規格書
262庫存量
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste No-Clean 250g Sn63/Pb37 T4
規格書
186在途量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste No-Clean 500g Sn63/Pb37 T4
規格書
9在途量
最少： 1
倍數： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik 焊料 Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
規格書
無庫存前置作業時間 6 週
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik 焊料 Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
規格書
N/A
最少： 1
倍數： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge