EasyPACK™ S Modules

Infineon Technologies EasyPACK™ S Modules deliver efficient power conversion in a compact, easy-to-integrate package built for modern power designs. The EasyPACK S family provides customers with a flexible, scalable power module platform featuring one of the broadest package and technology portfolios available. Its adaptable pin grid system simplifies layout and pinout customization for faster, more efficient design integration.

分離式半導體的類型

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結果: 2
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS 產品類型 技術 安裝風格
Infineon Technologies MOSFET模組 EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
60預期2026/7/23
最少: 1
倍數: 1

MOSFET Modules SiC Press Fit
Infineon Technologies IGBT 模組 EasyPACK module with TRENCHSTOP IGBT7/4 and emitter controlled 7 diode and NTC
60預期2026/7/9
最少: 1
倍數: 1

IGBT Modules Si Press Fit