Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers provide high thermal conductivity, low thermal resistance, and high reliability. These gap fillers minimize the bonding force between the components and heatsink during disassembly, which makes it easy to rework. The CR350S gap fillers' 1:1 mix is easily dispensable through a wide variety of dispensing equipment. These gap fillers feature a 3.6W/mK thermal conductivity and meet ROHS and REACH requirements. The A+B putty material cures in place after dispensing and mixing to perfectly fill the gap. Typical applications include automotive, graphics chips, microprocessors, and telecom base stations.
