CYW20822P4TAI040XUMA1

Infineon Technologies
726-CYW20822P4TAI040
CYW20822P4TAI040XUMA1

製造商:

說明:
藍芽模組-802.15.1 BLE INDUSTRIAL AND IOT

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 350

庫存:
350 可立即送貨
工廠前置作業時間:
29 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:

Pricing (TWD)

數量 單價
總價
NT$228.14 NT$228.14
NT$199.58 NT$1,995.80
NT$188.02 NT$4,700.50
NT$173.40 NT$17,340.00
NT$164.22 NT$41,055.00
完整捲(訂購多個500)
NT$150.28 NT$75,140.00
NT$148.58 NT$148,580.00
NT$148.24 NT$370,600.00
5,000 報價

商品屬性 屬性值 選擇屬性
Infineon
產品類型: 藍芽模組-802.15.1
RoHS:  
BLE, Bluetooth 5.0
I2C, SPI, UART
4 dBm
2 Mb/s
- 101 dBm
2.4 GHz to 2.5 GHz
1.7 V
3.3 V
- 40 C
+ 85 C
Reel
Cut Tape
天線: Trace
品牌: Infineon Technologies
核心: ARM Cortex M0
尺寸: 20.2 mm x 10.5 mm x 2.3 mm
高度: 2.3 mm
長度: 20.2 mm
存儲容量: 128 kB, 1 MB
濕度敏感: Yes
安裝風格: SMD/SMT
工作電源電壓: 1.7 V to 3.3 V
產品: Bluetooth Modules
產品類型: Bluetooth Modules
協議 - 藍牙、BLE (802.15.1): Bluetooth LE
原廠包裝數量: 500
子類別: Wireless & RF Modules
電源電流接收: 1.3 mA
電源電流傳輸: 3 mA
公司名稱: AIROC
寬度: 10.5 mm
零件號別名: CYW20822-P4TAI040 SP005963587
找到產品:
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所選屬性: 0

USHTS:
8517620090
JPHTS:
851762090
TARIC:
8517620000
ECCN:
5A992.C

CYW20822 BLUETOOTH® LE Modules

Infineon Technologies CYW20822 BLUETOOTH® LE Modules are fully integrated BLUETOOTH LE wireless modules. The devices include an onboard crystal oscillator, passive components, flash memory, and the CYW20822 silicon device. The CYW20822 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a PDM interface. The modules include a royalty-free BLUETOOTH stack compatible with the BLUETOOTH 5.0 core specified in a 20.2mm x 10.5mm x 2.3 mm package. The CYW20822 modules include 1MB of embedded flash memory and are pre-loaded with EZ-Serial firmware.

AIROC™ BLUETOOTH® & BLUETOOTH LE Modules

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE Modules assist users in developing Internet of Things (IoT) design quickly and efficiently. These modules greatly reduce development risk and accelerate time to market. Additionally, the modules are qualified by Bluetooth SIG and have received regulatory certification approval from organizations like FCC, ISED, MIC, and CE. This allows users to focus on creating unique IoT applications without worrying about the complexities of board bring-up, RF/spec testing, performance testing, and regulatory testing.