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F3L75R12W1H3B11BPSA1

Name: Infineon F3L75R12W1H3B11BPSA1
Brand: Infineon Technologies
SKU: 726-F3L75R12W1H3B11B
Price: 1351.9 TWD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

726-F3L75R12W1H3B11B

製造商編號：

F3L75R12W1H3B11BPSA1

製造商：

Infineon Technologies

說明：

IGBT 1200 V, 75 A 3-level IGBT module

規格書:

F3L75R12W1H3B11BPSA1 規格書 (PDF)

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商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	IGBT
RoHS:
技術:	Si
安裝風格:	Screw Mount
配置:	Quad
集電極-發射極最大電壓VCEO:	1.2 kV
集電極-發射極飽和電壓:	1.45 V
柵極發射機最大電壓:	- 20 V, 20 V
連續集電極電流在25 C:	75 A
Pd - 功率消耗 :	275 W
最低工作溫度:	- 40 C
最高工作溫度:	+ 150 C
系列:	High Speed IGBT H3
封裝:	Tray
品牌:	Infineon Technologies
產品類型:	IGBT Transistors
原廠包裝數量:	24
子類別:	IGBTs
公司名稱:	EasyPACK
零件號別名:	F3L75R12W1H3_B11 SP001355698
每件重量:	24 g

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合規守則

CNHTS:: 8504409190
USHTS:: 8541290065
TARIC:: 8541290000
ECCN:: EAR99

原產地分類

原產國:: 奧地利
封裝原產國:: 中國
擴散國:: 馬來西亞

出貨時，國家可能會有所變更。

1200V 3-level IGBT Modules

Infineon Technologies 1200V 3-level IGBT Modules deliver electrical performance and high reliability without limiting the design flexibility. The IGBT modules cover a range from only hundreds of watts to several megawatts. The 1200V IGBT Modules are designed for 3-level-applications.

EasyPACK™ 1B IGBT Power Modules

Infineon Technologies EasyPACK™ 1B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages are without a base plate enabling use in various applications. The Infineon EasyPACK 1B IGBT power modules cover the full power range from 20A up to 100A at 600V/650V/1200V in PIM or Six-Pack configurations. These modules offer a 135W to 275W power dissipation range and operate from -40°C up to +150°C or +175°C.

Reliable & Efficient Power Supply for Data Centers

Infineon Technologies Reliable and Efficient Power Supply for Data Centers are scalable solutions with power ratings from approximately 5kW to 50/60kW. This Infineon solution is ideal for uninterruptible power supplies (UPS) that require high power density and energy efficiency. These modules leverage various chip technologies, including Si IGBT, CoolSiC™ hybrid, and CoolSiC MOSFET, to meet diverse requirements for cost-effectiveness and performance. Infineon's portfolio addresses all system levels of a UPS with different voltage classes, and are set to expand offerings to include lower power rating classes.