THSF-ID7-B

ADLINK Technology
976-THSF-ID7-B
THSF-ID7-B

製造商:

說明:
散熱器 High profile heatsink with fan for Express-ID7 with threaded standoffs

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
0

您仍可購買此商品作為延期交貨訂單。

工廠前置作業時間:
18 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
NT$-.--
總價:
NT$-.--
估計關稅:
此產品免費航運

Pricing (TWD)

數量 單價
總價
NT$3,582.24 NT$3,582.24
NT$3,296.30 NT$32,963.00
NT$3,076.32 NT$76,908.00
NT$2,966.50 NT$148,325.00
NT$2,857.36 NT$285,736.00
250 報價

商品屬性 屬性值 選擇屬性
ADLINK Technology
產品類型: 散熱器
RoHS:  
Heat Sinks
品牌: ADLINK Technology
產品類型: Heat Sinks
原廠包裝數量: 1
子類別: Heat Sinks
類型: High Profile Heatsink
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

Express-ID7 Module

ADLINK Technology Express-ID7 Module is powered by the Intel® Xeon® D-1700 processor and offers integrated high-speed Ethernet (up to 4x 10G). The ADLINK Technology Express-ID7 also features 16 PCIe Gen4 lanes for immediate responsiveness. The device incorporates Intel® technologies like TCC, Deep Learning Boost (VNNI), and AVX-512 for accelerated AI performance. The Express-ID7 supports Time Sensitive Networking (TSN) for precisely controlling real-time workloads across networked devices. This rugged and edge AI-focused COM, featuring Intel® Ice Lake-D, empowers system integrators for diverse applications, including edge networking, robotics, autonomous driving, 5G, and more.