|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-1-K-TR
- Samtec
-
325:
NT$323.68
-
無庫存前置作業時間 50 週
|
Mouser 元件編號
200-LPAM20010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 50 週
|
|
|
NT$323.68
|
|
|
NT$277.10
|
|
|
報價
|
|
|
報價
|
|
最少: 325
倍數: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-2-K-TR
- Samtec
-
325:
NT$340.34
-
無庫存前置作業時間 50 週
|
Mouser 元件編號
200-LPAM20010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 50 週
|
|
|
NT$340.34
|
|
|
NT$291.38
|
|
|
報價
|
|
|
報價
|
|
最少: 325
倍數: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$434.18
-
無庫存前置作業時間 20 週
|
Mouser 元件編號
200-LPAM20010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 20 週
|
|
|
NT$434.18
|
|
|
NT$371.62
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
300:
NT$421.60
-
無庫存前置作業時間 15 週
|
Mouser 元件編號
200-LPAM20015L082KTR
|
Samtec
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
|
|
無庫存前置作業時間 15 週
|
|
|
NT$421.60
|
|
|
NT$360.74
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-1-K-TR
- Samtec
-
450:
NT$291.72
-
無庫存前置作業時間 13 週
|
Mouser 元件編號
200-LPAM20015S041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 13 週
|
|
|
NT$291.72
|
|
|
NT$249.56
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-1-K-TR
- Samtec
-
300:
NT$347.14
-
無庫存前置作業時間 15 週
|
Mouser 元件編號
200-LPAM20015S061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 15 週
|
|
|
NT$347.14
|
|
|
NT$296.82
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-2-K-TR
- Samtec
-
300:
NT$347.14
-
無庫存前置作業時間 15 週
|
Mouser 元件編號
200-LPAM20015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 15 週
|
|
|
NT$347.14
|
|
|
NT$296.82
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
300:
NT$442.68
-
無庫存前置作業時間 26 週
|
Mouser 元件編號
200-LPAM20015S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 26 週
|
|
|
NT$442.68
|
|
|
NT$378.76
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-1-K-TR
- Samtec
-
325:
NT$490.96
-
無庫存前置作業時間 50 週
|
Mouser 元件編號
200-LPAM30010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 50 週
|
|
|
NT$490.96
|
|
|
NT$420.24
|
|
|
NT$360.06
|
|
最少: 325
倍數: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-04-2-K-TR
- Samtec
-
475:
NT$340.34
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM30010S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
|
NT$340.34
|
|
|
NT$291.38
|
|
|
報價
|
|
|
報價
|
|
最少: 475
倍數: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-1-K-TR
- Samtec
-
325:
NT$516.46
-
無庫存前置作業時間 51 週
|
Mouser 元件編號
200-LPAM30010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 51 週
|
|
|
NT$516.46
|
|
|
NT$442.00
|
|
|
NT$378.76
|
|
最少: 325
倍數: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$330.48
-
無庫存前置作業時間 50 週
|
Mouser 元件編號
200-LPAM30015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 50 週
|
|
|
NT$330.48
|
|
|
NT$282.88
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$501.50
-
無庫存前置作業時間 26 週
|
Mouser 元件編號
200-LPAM30015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 26 週
|
|
|
NT$501.50
|
|
|
NT$429.08
|
|
|
NT$367.88
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$347.14
-
無庫存前置作業時間 51 週
|
Mouser 元件編號
200-LPAM30015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 51 週
|
|
|
NT$347.14
|
|
|
NT$296.82
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
NT$490.96
-
無庫存前置作業時間 20 週
|
Mouser 元件編號
200-LPAM40010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 20 週
|
|
|
NT$490.96
|
|
|
NT$420.24
|
|
|
NT$360.06
|
|
最少: 325
倍數: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$626.28
-
無庫存前置作業時間 26 週
|
Mouser 元件編號
200-LPAM40010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 26 週
|
|
|
NT$626.28
|
|
|
NT$535.84
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-06-2-K-TR
- Samtec
-
325:
NT$516.46
-
無庫存前置作業時間 20 週
|
Mouser 元件編號
200-LPAM40010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 20 週
|
|
|
NT$516.46
|
|
|
NT$442.00
|
|
|
NT$378.76
|
|
最少: 325
倍數: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$658.92
-
無庫存前置作業時間 37 週
|
Mouser 元件編號
200-LPAM40010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 37 週
|
|
|
NT$658.92
|
|
|
NT$563.72
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$421.60
-
無庫存前置作業時間 20 週
|
Mouser 元件編號
200-LPAM40015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 20 週
|
|
|
NT$421.60
|
|
|
NT$360.74
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$786.08
-
無庫存前置作業時間 37 週
|
Mouser 元件編號
200-LPAM50010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 37 週
|
|
|
NT$786.08
|
|
|
NT$576.64
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$786.08
-
無庫存前置作業時間 26 週
|
Mouser 元件編號
200-LPAM50010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 26 週
|
|
|
NT$786.08
|
|
|
NT$576.64
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$801.38
-
無庫存前置作業時間 17 週
|
Mouser 元件編號
200-LPAM50015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 17 週
|
|
|
NT$801.38
|
|
|
NT$587.86
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$412.76
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM2001.0L081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
|
NT$412.76
|
|
|
NT$353.26
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$434.18
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM2001.0S081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$434.18
|
|
|
NT$371.62
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|