|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-1-K-TR
- Samtec
-
325:
NT$516.46
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM30010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
|
NT$516.46
|
|
|
NT$442.00
|
|
|
NT$378.76
|
|
最少: 325
倍數: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$330.48
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
|
NT$330.48
|
|
|
NT$282.88
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
NT$630.70
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
|
NT$630.70
|
|
|
NT$603.16
|
|
|
NT$580.38
|
|
|
NT$538.22
|
|
|
NT$393.38
|
|
|
檢視
|
|
|
NT$462.06
|
|
|
NT$336.60
|
|
|
報價
|
|
最少: 1
倍數: 1
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$501.50
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM30015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$501.50
|
|
|
NT$429.08
|
|
|
NT$367.88
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-2-K-TR
- Samtec
-
300:
NT$501.50
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$501.50
|
|
|
NT$429.08
|
|
|
NT$367.88
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$347.14
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM30015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
|
NT$347.14
|
|
|
NT$296.82
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-06-2-K-TR
- Samtec
-
300:
NT$412.76
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
|
NT$412.76
|
|
|
NT$353.26
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
NT$526.66
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$526.66
|
|
|
NT$450.50
|
|
|
NT$386.24
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$526.66
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
|
NT$526.66
|
|
|
NT$450.50
|
|
|
NT$386.24
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-40-01.0-L-04-2-K-TR
- Samtec
-
475:
NT$412.76
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM40010L042KTR
|
Samtec
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
|
|
無庫存前置作業時間 10 週
|
|
|
NT$412.76
|
|
|
NT$353.26
|
|
|
報價
|
|
|
報價
|
|
最少: 475
倍數: 475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
NT$490.96
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$490.96
|
|
|
NT$420.24
|
|
|
NT$360.06
|
|
最少: 325
倍數: 325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$626.28
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM40010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$626.28
|
|
|
NT$535.84
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-06-2-K-TR
- Samtec
-
325:
NT$516.46
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$516.46
|
|
|
NT$442.00
|
|
|
NT$378.76
|
|
最少: 325
倍數: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$658.92
-
無庫存前置作業時間 8 週
|
Mouser 元件編號
200-LPAM40010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 8 週
|
|
|
NT$658.92
|
|
|
NT$563.72
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$421.60
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$421.60
|
|
|
NT$360.74
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
NT$421.60
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$421.60
|
|
|
NT$360.74
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$639.54
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM40015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$639.54
|
|
|
NT$547.40
|
|
|
報價
|
|
|
報價
|
|
最少: 300
倍數: 300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
NT$442.68
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM40015S041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
|
NT$442.68
|
|
|
NT$324.70
|
|
最少: 450
倍數: 450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$442.68
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM40015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$442.68
|
|
|
NT$378.76
|
|
|
報價
|
|
|
報價
|
|
最少: 450
倍數: 450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$786.08
-
無庫存前置作業時間 8 週
|
Mouser 元件編號
200-LPAM50010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 8 週
|
|
|
NT$786.08
|
|
|
NT$576.64
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$786.08
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM50010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$786.08
|
|
|
NT$576.64
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$801.38
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM50015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
|
NT$801.38
|
|
|
NT$587.86
|
|
最少: 300
倍數: 300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-1-K-TR
- Samtec
-
650:
NT$185.64
-
無庫存前置作業時間 3 週
-
新產品
|
Mouser 元件編號
200-LPAF1003.5L041K
新產品
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$185.64
|
|
|
NT$158.78
|
|
最少: 650
倍數: 650
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-1-K-TR
- Samtec
-
350:
NT$381.82
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAF2003.0L081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
|
NT$381.82
|
|
|
NT$326.74
|
|
|
NT$280.16
|
|
最少: 350
倍數: 350
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-1-K-TR
- Samtec
-
550:
NT$326.74
-
無庫存前置作業時間 6 週
-
新產品
|
Mouser 元件編號
200-LPAF4003.0L041K
新產品
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
|
NT$326.74
|
|
|
NT$280.16
|
|
最少: 550
倍數: 550
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|