HD Express® Interconnect System

Amphenol TCS HD Express® Interconnect System is a high-performance, high-density backplane solution designed to meet PCIe Generation 6 mechanical and electrical requirements for 85Ω impedance systems. Engineered with a single-wafer design, this system enables easy system scaling and offers a competitive cost structure. All press-fit pins ensure reliable board terminations, making the Amphenol TCS HD Express Interconnect System ideal for servers, storage, and high-performing applications.

結果: 4
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 定位數 排數 間距 終端類型 封裝
Amphenol TCS 高速/模組連接器 HD Express Backplane 4Pr, 4Pos
171預期2026/5/7
最少: 1
倍數: 1

Backplane Connector 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS 高速/模組連接器 HD Express Backplane 4Pr, 16Pos
54預期2026/5/7
最少: 1
倍數: 1

Backplane Connector 128 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS 高速/模組連接器 HD Express Daughter Card 4Pr, 4Pos
120預期2026/5/7
最少: 1
倍數: 1

Daughter Card Module 32 Position 4 Row 2 mm Press-Fit Tray
Amphenol TCS 高速/模組連接器 HD Express Daughter Card 4Pr, 16Pos
40預期2026/5/7
最少: 1
倍數: 1

Daughter Card Module 128 Position 4 Row 2 mm Press-Fit Tray