M Series D-Sub & Micro-D Connectors

AirBorn M Series D-Sub and Micro-D Connectors are designed for mission-critical applications where high density and high reliability are required. These connectors feature a rugged and reliable design as well as easy customization. AirBorn M Series interconnects are offered in I/O, straight, right-angle, and connector saver models. One-, two-, three-, and four-row options are available with 9 to 128 contacts and 0.050" (1.27mm) contact spacing. AirBorn M Series D-Sub Connectors are qualified to MIL-DTL-83513 requirements. Typical applications include navigation, radar, communications, avionics, medical devices, engine control, and more.

D-Sub連接器的類型

變更類別視圖
結果: 87
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS 類型 定位數
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 4 Row NIC 無庫存前置作業時間 9 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 CONNECTOR, M SERIES 無庫存前置作業時間 9 週
最少: 10
倍數: 1

AirBorn D-Sub後殼 CONNECTOR, M SERIES 無庫存前置作業時間 9 週
最少: 1
倍數: 1
AirBorn D-Sub後殼 .050" Low Profile Backshell Metal 無庫存前置作業時間 10 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 .050" Rugged Metal I/O Connector, 2 Row, Str RECPT, Sz 9 無庫存前置作業時間 20 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 20 週
最少: 6
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 20 週
最少: 3
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 37 Position
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 15 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 16 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 3 Row NIC 無庫存前置作業時間 15 週
最少: 10
倍數: 1

EMI/RFI Backshell
AirBorn D-Sub後殼 Rugged Backshell 3 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell