AirBorn D-Sub後殼

結果: 60
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 類型 外殼大小 電纜引入角 電纜引入處數量 外殼質料 外殼板 定位數
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 6庫存量
最少: 1
倍數: 1
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 BACKSHELL, M SERIES 2庫存量
10預期2026/11/9
最少: 1
倍數: 1

EMI/RFI Backshell 31 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 1庫存量
最少: 1
倍數: 1

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 1庫存量
最少: 1
倍數: 1

EMI/RFI Backshell 25 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Micro-D, Metal, EMI/RFI Backshells, Straight Cable Exit, 2 Row, Aluminum w/ nickel plating, 15 Pos 5庫存量
最少: 1
倍數: 1

Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 8庫存量
最少: 1
倍數: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
Molex / AirBorn D-Sub後殼 Rugged Backshell 3 Row NIC 7庫存量
最少: 1
倍數: 1

EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 1庫存量
最少: 1
倍數: 1
EMI/RFI Backshell 21 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row CAD 6庫存量
最少: 1
倍數: 1
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub後殼 Rugged Backshell 4 Row CAD 1庫存量
最少: 1
倍數: 1
EMI/RFI Backshell 100 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub後殼 Rugged Backshell 3 Row NIC
3預期2027/2/17
最少: 1
倍數: 1

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 4 Row NIC
4預期2027/2/9
最少: 1
倍數: 1

EMI/RFI Backshell 100 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 .050" Rugged Metal I/O Connector, 2 Row, Str RECPT, Sz 9 無庫存前置作業時間 20 週
最少: 1
倍數: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 25
倍數: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 26 週
最少: 5
倍數: 1

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 25 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 25 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 無庫存前置作業時間 26 週
最少: 1
倍數: 1

EMI/RFI Backshell 37 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 1
倍數: 1

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 4 (C) Straight 1 Entry Aluminum Nickel 37 Position
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 1
倍數: 1

EMI/RFI Backshell 37 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub後殼 Rugged Backshell 2 Row NIC 暫無庫存
最少: 10
倍數: 1

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel