xGM260P無線模組

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth®, Zigbee®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.

結果: 6
選擇 圖像 零件編號
 製造商
說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 系列
頻率
輸出功率
接口類型
電源電壓 - 最小值
電源電壓 - 最大值
最低工作溫度
最高工作溫度
尺寸
協議 - 藍牙、BLE (802.15.1)
協議 - ANT、Thread、Zigbee (802.15.4)
封裝
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
276庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape


Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
117庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
177庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
182庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
159庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
25庫存量
200在途量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape