Bluetooth, BLE 多協議模組

結果: 37
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 封裝
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 20 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 20 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 20 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 23 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 23 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 無庫存前置作業時間 23 週
最少: 1,000
倍數: 1,000
: 1,000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
NXP Semiconductors 多協議模組 IW610BHN/A1ZDI 無庫存前置作業時間 16 週
最少: 2,700
倍數: 2,700
: 2,700

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors 多協議模組 IW610FHN/A1ZDI 無庫存前置作業時間 16 週
最少: 1,300
倍數: 1,300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
u-blox 多協議模組 Wi-Fi and Bluetooth Multiradio MCU module with antenna pin 暫無庫存
最少: 500
倍數: 500
: 500

NINA-W10 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3.3 V 3.3 V - 40 C + 85 C PCB 10 mm x 10.6 mm x 2.2 mm Bluetooth, BLE 802.11 b/g/n Reel
Advantech 9668T77300E
Advantech 多協議模組 TREK-773 WLAN kit (802.11a/b/g/n BT combo) 暫無庫存
最少: 1
倍數: 1
Bluetooth, BLE
Advantech UTC-WIFI-A1E
Advantech 多協議模組 EWM-W168H01E, 802.11ac/a/b/g/n, 2T2R, BT4.2, HMC 暫無庫存
最少: 1
倍數: 1

Bluetooth, BLE 802.11 a/b/g/n
Quectel 多協議模組 無庫存前置作業時間 5 週
最少: 1
倍數: 1

2.4 GHz, 5 GHz Audio, Bluetooth, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SD Card, UART, USB, USIM, Video, WiFi 4 V 4 V - 35 C + 75 C 44 mm x 43 mm x 2.85 mm Bluetooth, BLE GSM/EDGE, WCDMA GNSS