3.135 V 多協議模組

結果: 27
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - WiFi (802.11) 封裝
Sierra Wireless 多協議模組 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35 199庫存量
最少: 1
倍數: 1

USB 3.135 V 4.4 V Tray

Ezurio 多協議模組 2.4GHz + 5GHz WiFi AC module + BT5.0
2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 70 C u.FL 13 mm x 18 mm Bluetooth 4.1 802.11 a/b/g/n/ac
Silex Technology 多協議模組 [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount 75庫存量
678在途量
最少: 1
倍數: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology 多協議模組 Type A USB Connector Sample Piece 13庫存量
最少: 1
倍數: 1

SX-USBAC 2.4 GHz, 5 GHz USB 3.135 V 3.465 V - 20 C + 85 C MHF1 22 mm x 21 mm x 2.75 mm 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac Bulk
Silex Technology 多協議模組 [Bulk SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. 100庫存量
最少: 100
倍數: 100

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
u-blox 多協議模組 M.2 card with MAYA-W161, single package 30庫存量
最少: 1
倍數: 1

MAYA-W1 2.4 GHz, 5 GHz 10 dBm, 18 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 2.59 mm Bluetooth 5.2 Tray
Advantech 多協議模組 Wi-Fi 5 + BT Module 24/5GHz Mini PCIe 108庫存量
最少: 1
倍數: 1
2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C SMA 26.65 mm x 29.85 mm x 3.25 mm Bluetooth 4.2 802.11 a/b/g/n/ac
u-blox 多協議模組 M.2 card with JODY-W377, single package
23預期2026/7/23
最少: 1
倍數: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Silex Technology 多協議模組 2x2 Dual Band 802.11 ac WLAN+BT PCIe
88預期2026/8/3
最少: 1
倍數: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多協議模組 [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
171預期2026/7/20
最少: 1
倍數: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多協議模組 [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
97在途量
最少: 1
倍數: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
u-blox 多協議模組 M.2 card with JODY-W377, in tray, SDIO interface 無庫存前置作業時間 18 週
最少: 1
倍數: 1

2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Sierra Wireless 多協議模組 No eSIM - EM8695,GENERIC,01.01.01.00,,,GNSS=ABCD,SWIR IMEI,, 暫無庫存
最少: 1,000
倍數: 100
USB 3.135 V 4.4 V Tray
ADLINK Technology EWK-M2-AC9260-ET
ADLINK Technology 多協議模組 INTEL AC9260 IND. WIFI w/ mPCIe converter 暫無庫存
最少: 1
倍數: 1
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
ADLINK Technology EWK-M2-AX210-ET
ADLINK Technology 多協議模組 Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV 暫無庫存
最少: 1
倍數: 1
M.2, PCIe 3.135 V 3.465 V - 40 C + 80 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
ADLINK Technology EWK-M2-AC9260-ET W MPCIE CONVERTER
ADLINK Technology 多協議模組 INTEL AC9260 IND. WIFI w/ mPCIe converter 暫無庫存
最少: 1
倍數: 1
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
ADLINK Technology EWK-M2-AC9260 w/ mPCIe converter
ADLINK Technology 多協議模組 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-70C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna 暫無庫存
最少: 1
倍數: 1
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V 0 C + 70 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac
Silex Technology 多協議模組 [Sample Pack] SX-PCEAX-HMC-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-HMC-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini P 無庫存前置作業時間 40 週
最少: 1
倍數: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology 多協議模組 1x1 Wi-Fi+BLE radio /basbnd SDIO EvalMod 無庫存前置作業時間 30 週
最少: 1
倍數: 1

SX-SDCAC 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多協議模組 802.11ac+Bluetooth SDIO card SoC 無庫存前置作業時間 30 週
最少: 1
倍數: 1

SX-PCEAC2 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多協議模組 802.11a/b/g/n/ac SDIO SiP 2.4/5 GHz 無庫存前置作業時間 34 週
最少: 1
倍數: 1

SX-SDPAC 2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 20 C + 80 C u.FL 6.9 mm x 6.9 mm x 1.082 mm Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Silex Technology 多協議模組 Surface Mount Sample Piece 無庫存前置作業時間 30 週
最少: 1
倍數: 1

SX-USBAC 2.4 GHz, 5 GHz USB 3.135 V 3.465 V - 20 C + 85 C MHF1 22 mm x 21 mm x 2.75 mm 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac Cut Tape
Silex Technology 多協議模組 SMPL 802.11a/b/g/nac WLAN + BLE 4.2 SDIO 前置作業時間 30 週
最少: 1
倍數: 1

2.4 GHz, 5 GHz SDIO, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 19 mm x 30 mm x 2.4 mm Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Quectel 多協議模組 無庫存前置作業時間 5 週
最少: 1
倍數: 1
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS
Quectel 多協議模組 5G R17 Redcap, 5G SA only, LTE CAT4, miniPCIe FF, Global version (newer PCB revision) 無庫存前置作業時間 30 週
最少: 1
倍數: 1
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Tray