ADLINK Technology 單板運算外殼

結果: 4
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說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 產品
類型
材料
ADLINK Technology AmSTX-CF Cooler Pizza BOX
ADLINK Technology 單板運算外殼 Size:282x249x138mm;Outer facing: A case, 230g/m2;Medium Paper: 100g/m2;Pressure: 14kgf/cm2 暫無庫存
最少： 1
倍數： 1
Cases
ADLINK Technology AMSTX-CF CPU Backing Plate
ADLINK Technology 單板運算外殼 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm 暫無庫存
最少： 1
倍數： 1
Accessories CPU Backing Plate
ADLINK Technology AmSTX-CF Large EPE Bottom
ADLINK Technology 單板運算外殼 Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms 暫無庫存
最少： 1
倍數： 1
Accessories Large EPE Bottom Expanded Polyethylene (EPE)
ADLINK Technology AmSTX-CF Large EPE Top
ADLINK Technology 單板運算外殼 Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms 暫無庫存
最少： 1
倍數： 1
Accessories Large EPE Top Expanded Polyethylene (EPE)