Renesas / Dialog 射頻與無線裝置

藍芽模組-802.15.1 Bluetooth Low Energy 5.2 Module with integrated ARM Cortex M33, memories and peripherals

藍芽開發工具-802.15.1 Daughterboard for DA14683DEVKT-P Pro

藍芽開發工具-802.15.1 Connectivity Production Line Tool companion board for debugging

藍芽開發工具-802.15.1 Connectivity Production Line Tool Kit for Bluetooth LE devices

RF系統單晶片 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package

RF系統單晶片 - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch

WiFi模組 -802.11 Wi-Fi module, Wi-Fi6 Dual Band 2.4/5GHz 802.11a/b/g/n/ax, 8Mbyte Flash, u.FL connector

多協議模組 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, PCB trace antenna

多協議模組 Wi-Fi/BLE combo module, Wi-Fi6 Dual Band 2.4/5GHz 802.11 a/b/g/n/ax, 8Mbyte Flash, RF antenna pin

多協議模組 Wi-Fi6/BLE combo - Single band 2.4GHz, 802.11 b/g/n/ax, 8Mbyte Flash, PCB trace antenna

RF系統單晶片 - SoC Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch package

RF系統單晶片 - SoC Bluetooth dual mode audio SoC with Open platform DSP