ADLINK Technology 半導體

CPU - 中央處理器 CPU, Xeon Gold 5218, 2.30GHz, 16-Core, 22MB Cache, Cascade Lake, CD8069504193301 SRF8T, Step:B1, MM# 999AZ7

CPU - 中央處理器 CPU, Xeon Gold 5218R, 2.10GHz, 20-Core, 27.5MB Cache, Cascade Lake, CD8069504446300 SRGZ7, Step:B1, MM# 999PKD

CPU - 中央處理器 CPU, Xeon Silver 4214R, 2.40GHz, 12-Core, 16.5MB Cache, Cascade Lake, CD8069504343701 SRG1W, Step:L1, MM# 999H4H

CPU - 中央處理器 CPU, Xeon Silver 4216, 2.10GHz, 16-Core, 22MB Cache, Cascade Lake, CD8069504213901 SRFBB, Step:L1, MM# 999CM3

硬件調試器 DB30 Multi Purpose Debug Board for SMARC

記憶體模組 DDR2 PC2-5300, 512MB, 64Mx64, SO-DIMM 200P, 1.8V, Rank:1, CL5, Non-ECC, OP Temp:0 85, Fix Die:No(M-die), Micron M-die

記憶體模組 DDR3-1333, 4GB, 512Mx72, VLP RDIMM 244P, 1.5V, Rank:1, CL9, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(512Mx8)

記憶體模組 DDR3-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.5V, Rank:1, CL9, Non-ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(256Mx8)

記憶體模組 DDR3-1333, 4GB, 512Mx72, SO-DIMM 204P, 1.5V, Rank:2, CL9, ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(256Mx8)

記憶體模組 DDR3-1600, 4GB, 512Mx64, UDIMM 240P, 1.5V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No(E-die), Samsung Chip(512Mx8)

記憶體模組 DDR3L-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL9, Non-ECC, OP Temp:0 85, Fix Die:Yes(F-die), Samsung Chip(256Mx8), SPD Write-Protection

記憶體模組 DDR3L-1333, 4GB, 512Mx64, SO-DIMM 204P, 1.35V, Rank:2, CL9, Non-ECC, OP Temp:0 85, Fix Die:No, Samsung Chip(256Mx8)