ADLINK Technology 半導體

固態驅動 - SSD SSD, mSATA, SATA 6Gbps, 32GB, 3.3V, Toshiba MLC, 200MB SR/40MB SW, TBW:9.6TB, MTBF>3MH, OP Temp:-40-85

固態驅動 - SSD SSD, M.2 2280 B+M-Key, SATA 6Gbps, 64GB, 3.3V, WD-BICS4 3D TLC, 400MB SR/200MB SW, TBW:110TB, MTBF:3MH, OP Temp:-20-75

開發板及套件 - x86 Starterkit-COM Express 7 PLUS-Full CopperCOM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full BaseT Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

開發板及套件 - x86 COM Express Type 6 R3.1 Prototype kit

開發板及套件 - x86 COM-HPC formfactor starterkit with COM-HPC Server Base, 4x 10GBASE-T OCP and accessory kit for COM-HPC-sIDH (order COM-HPC module, memory and thermal solution separately!)

開發板及套件 - x86 COM-HPC formfactor starterkit with COM-HPC Server Base, 4x 10G SFP+ OCP and accessory kit for COM-HPC-sIDH (order COM-HPC module, memory and thermal solution separately!)

USB快閃硬碟 4GB Low Profile USB flash module kit

CPU - 中央處理器 CPU, Celeron G1820TE, 2.20GHz, 2-Core, 2MB SmartCache, Haswell, CM8064601618705 SR1T6, Step:C0, MM# 932857

記憶體模組 DDR4-3200, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No(A-die), Samsung Chip(2Gx8), anti-sulfur, hight:30mm

記憶體模組 DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8), anti-sulfur

USB快閃硬碟 USB Flash Module, USB2.0, 4GB, 5V, 37.9x26.65x9mm, OP Temp:0-70, UFM connector

多協議開發工具 WiFi kit-AW-CM276MA-SUR-SDIO