i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.

嵌入式處理器和控制器的類型
變更類別視圖
結果: 20
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說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS 產品類型
安裝風格
封裝/外殼
核心
數據匯流排寬度
最高時鐘頻率
L1快取指令記憶體
L1快取資料記憶體
數據存儲器大小
最低工作溫度
最高工作溫度
封裝
NXP Semiconductors 處理器 - 專門應用 8ULP, Dual Cortex A35
規格書
1,200庫存量
最少： 1
倍數： 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
1,128庫存量
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
414庫存量
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
507庫存量
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors 處理器 - 專門應用 i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
25預期2026/8/21
最少： 1
倍數： 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
25預期2026/8/21
最少： 1
倍數： 1
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors 處理器 - 專門應用 i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
25預期2026/8/21
最少： 1
倍數： 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
25預期2026/7/7
最少： 1
倍數： 1
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 630
倍數： 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1
倍數： 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors 處理器 - 專門應用 i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1,200
倍數： 1,200

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 630
倍數： 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1,200
倍數： 1,200
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 630
倍數： 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors 處理器 - 專門應用 i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1,200
倍數： 1,200

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 630
倍數： 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 1,200
倍數： 1,200
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF系統單晶片 - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
規格書
無庫存前置作業時間 16 週
最少： 630
倍數： 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray