Dynamic Random Access Memory (DRAM)

Intelligent Memory Dynamic Random Access Memory (DRAM) includes a full range of JEDEC-compliant DRAMs and ECC DRAMs (SDRAM, DDR, DDR2, DDR3, DDR4, LPDDR4). From an application's point of view, these components work like a monolithic device. The DRAM devices allow for maximum levels of memory density without altering existing board layouts or designs.

記憶體 IC的類型

變更類別視圖
結果: 55
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS 產品類型 安裝風格 封裝/外殼 存儲容量 組織 最低工作溫度 最高工作溫度 封裝
Intelligent Memory DRAM DDR2 512Mb, 1.8V, 32Mx16, 400MHz (800Mbps), 0C to +95C, FBGA-84 209庫存量
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-60 512 Mbit 32 M x 16 - 40 C + 95 C Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 4Mx16, 166MHz (166Mbps), -40C to +85C, FBGA-54 241庫存量
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-54 64 Mbit 4 M x 16 - 40 C + 85 C Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 4Mx16, 166MHz (166Mbps), -40C to +85C, TSOPII-54 43庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 64 Mbit 4 M x 16 - 40 C + 85 C Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, TSOPII-86 264庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-86 64 Mbit 2 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM ECC SDRAM, 256Mb, 3.3V, 8Mx32, 166MHz (166Mbps), -40C to +85C, TSOPII-86 176庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-86 256 Mbit 8 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM ECC SDRAM, 512Mb, 3.3V, 64Mx8, 133MHz (133Mbps), -40C to +85C, TSOPII-54 79庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 512 Mbit 64 M x 8 - 40 C + 85 C Tray
Intelligent Memory 記憶體模組 記憶體模組, DDR3, DIMM, 16GB, x72, 240pin UDIMM, 1600MT/s, PC3-12800, 1.35V, ECC, Double Rank, 30mm, C-Temp 4庫存量
最少: 1
倍數: 1

Memory Modules 16 GB 0 C + 95 C Tray
Intelligent Memory DRAM SDRAM, 128Mb, 3.3V, 4Mx32, 166MHz (166Mbps), -40C to +85C, TSOPII-86 364庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-86 128 Mbit 4 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM ECC DDR2, 1Gb, 1.8V, 64Mx16, 400MHz (800Mbps), -40C to +95C, FBGA-84 111庫存量
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-84 1 Gbit 64 M x 16 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC SDRAM, 512Mb, 3.3V, 16Mx32, 166MHz (166Mbps), -40C to +85C, TSOPII-86 144庫存量
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-86 512 Mbit 16 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM DDR4 8Gb, 1.2V, 512Mx16, 1600MHz (3200Mbps), -40C to +95C, FBGA-96
623在途量
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-96 8 Gbit 512 M x 16 - 40 C + 95 C Tray
Intelligent Memory DRAM DDR3 4Gb, 1.35V/1.5V, 256Mx16, 933MHz (1866Mbps), 0C to +95C, FBGA-96
412預期2026/2/25
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-96 4 Gbit 256 M x 16 0 C + 95 C Tray
Intelligent Memory DRAM SDRAM, 256Mb, 3.3V, 16Mx16, 166MHz (166Mbps), -40C to +85C, TSOPII-54
232預期2026/4/1
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 256 Mbit 16 M x 16 - 40 C + 85 C Tray
Intelligent Memory DRAM ECC SDRAM, 512Mb, 3.3V, 32Mx16, 133MHz (133Mbps), 0C to +70C, TSOPII-54
216預期2026/5/21
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 512 Mbit 32 M x 16 0 C + 70 C Tray
Intelligent Memory DRAM ECC SDRAM, 512Mb, 3.3V, 32Mx16, 133MHz (133Mbps), -40C to +85C, TSOPII-54
108預期2026/5/21
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 512 Mbit 32 M x 16 - 40 C + 85 C Tray
Intelligent Memory DRAM DDR2 1Gb, 1.8V, 64Mx16, 400MHz (800Mbps), -40C to +95C, FBGA-84 無庫存前置作業時間 8 週
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-84 1 Gbit 64 M x 16 - 40 C + 95 C Tray
Intelligent Memory DRAM DDR3 2Gb, 1.35V/1.5V, 128Mx16, 800MHz (1600Mbps), 0C to +95C, FBGA-96 無庫存前置作業時間 8 週
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-96 2 Gbit 128 M x 16 0 C + 95 C Tray
Intelligent Memory DRAM DDR3 4Gb, 1.35V/1.5V, 512Mx8, 933MHz (1866Mbps), 0C to +95C, FBGA-78 無庫存前置作業時間 6 週
最少: 242
倍數: 242

DRAM SMD/SMT FBGA-78 4 Gbit 512 M x 8 0 C + 95 C Tray
Intelligent Memory DRAM DDR3 4Gb, 1.35V/1.5V, 512Mx8, 933MHz (1866Mbps), -40C to +95C, FBGA-78 無庫存前置作業時間 6 週
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-78 4 Gbit 512 M x 8 - 40 C + 95 C Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54 無庫存前置作業時間 8 週
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-90 64 Mbit 2 M x 32 - 40 C + 85 C Tray
Intelligent Memory DRAM DDR3 8Gb, 1.35V/1.5V, 1Gx8 (1CS), 933MHz (1866Mbps), -40C to +95C, FBGA-78 前置作業時間 6 週
最少: 1
倍數: 1

DRAM SMD/SMT FBGA-78 8 Gbit 1 G x 8 - 40 C + 95 C Tray
Intelligent Memory DRAM DDR3 8Gb, 1.35V/1.5V, 512Mx16 (2CS), 933MHz (1866Mbps), -40C to +95C, FBGA-96 無庫存前置作業時間 6 週
最少: 180
倍數: 180

DRAM SMD/SMT FBGA-96 8 Gbit 512 M x 16 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC SDRAM, 512Mb, 3.3V, 64Mx8, 133MHz (133Mbps), 0C to +70C, TSOPII-54 前置作業時間 12 週
最少: 1
倍數: 1

DRAM SMD/SMT TSOP-II-54 512 Mbit 64 M x 8 0 C + 70 C Tray
Intelligent Memory 記憶體模組 記憶體模組, DDR3, DIMM, 16GB, x64, 240pin UDIMM, 1600MT/s, PC3-12800, 1.35V, Non-ECC, Double Rank, 30mm, C-Temp 無庫存前置作業時間 6 週
最少: 4
倍數: 4

Memory Modules 16 GB 0 C + 95 C Tray
Intelligent Memory 記憶體模組 記憶體模組, DDR3, SODIMM, 16GB, x64, 204pin SODIMM, 1600MT/s, PC3-12800, 1.35V, Non-ECC, Double Rank, 30mm, C-Temp 無庫存前置作業時間 6 週
最少: 4
倍數: 4

Memory Modules 16 GB 0 C + 95 C Tray