Digi ConnectCore 8M Mini
Digi ConnectCore 8M Mini is based on the NXP® i.MX 8M Mini application processor is a secure integrated system-on-module (SOM) platform. The ConnectCore 8M Mini is designed for a wide range of industrial, medical, agricultural, and transportation applications, including Internet of Things (IoT), human-machine interface (HMI), equipment monitoring, audio/voice, graphics/video, edge computing, and machine learning.
The Digi ConnectCore 8M Mini features four power-efficient Arm® Cortex®-A53 cores, one Cortex-M4 core, and the Digi Microcontroller Assist Cortex-M0, which allows power consumption minimization while maintaining a high standard of performance. With a 10+ year product lifecycle, OEMs can reduce their development costs and achieve a lower total cost of ownership. This is enabled by leveraging pre-certified wireless connectivity, remote management, cloud integration, and complete Linux Yocto Project and Android software platform support.
Features
- Industrial i.MX 8M Mini quad-core system-on-module
- Digi SMTplus® form factor (40mm x 45mm) for ultimate reliability and design freedom
- Power management with both hardware and software support for low-power designs
- Display and camera capabilities with graphics and video hardware acceleration
- Pre-certified dual-band 802.11a/b/g/n/ac 1x1 and BLUETOOTH® 5 connectivity
- Seamless cellular modem and Digi XBee® wireless integration
- Cloud and edge-compute services integration
- Video capabilities with built-in VPU
- Built-in device security, identity, and privacy with Digi TrustFence® and a hardware Secure Element
- Remote monitoring and management with Digi Remote Manager®
- Yocto Project Linux and Android support
Applications
- Industrial
- Medical
- Agricultural
- Transportation
Videos
Block Diagram
Additional Block Diagram
Associated Kits
Digi ConnectCore 8M Mini Development Kit
A System-on-Module (SOM) platform based on the NXP® i.MX 8M Mini applications processor.
Digi CC-ACC-LCDH-10 LCD應用套件
包含帶有電容式觸控螢幕的10吋WXGA (1280x800) LCD面板。
發佈日期: 2021-04-02
| 更新日期: 2024-02-29