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EBTF-6-10-2.0-S-RA-1-R

Name: Samtec EBTF-6-10-2.0-S-RA-1-R
Brand: Samtec
SKU: 200-EBTF-6102.0SRA1R
Price: 1545.49 TWD
Availability: OutOfStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-EBTF-6102.0SRA1R

製造商編號：

EBTF-6-10-2.0-S-RA-1-R

製造商：

Samtec

說明：

高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Right-Angle Receptacle

規格書:

EBTF-6-10-2.0-S-RA-1-R 規格書 (PDF)

ECAD模型:

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更多資訊

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	高速/模組連接器
RoHS:
產品:	Receptacles
定位數:	120 Position
排數:	10 Row
間距:	2 mm
終端類型:	Solder Pin
觸點电镀:	Gold
系列:	EBTF
封裝:	Tray
品牌:	Samtec
觸點材料:	Copper Alloy
额定电流:	4.2 A
外殼顏色:	Black
外殼材料:	Liquid Crystal Polymer (LCP)
最高工作溫度:	+ 105 C
最低工作溫度:	- 55 C
裝配角:	Right Angle
產品類型:	High Speed / Modular Connectors
原廠包裝數量:	16
子類別:	Backplane Connectors
公司名稱:	ExaMAX

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所選屬性: 0

篩選文檔:

規格書

EBTF-6-10-2.0-S-RA-1-R 規格書 (PDF)

合規守則

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

原產地分類

原產國:: 美國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.