所有結果 (665)

CPU和晶片散熱器 Standard passive cooling solution for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 26.3mm.

散熱器 Standard heatspreader for conga-JC370 (bore hole). Total height 12mm.

開發板及套件 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C.

乙太網模組 COM_HPC Mezzanine card with 2x Intel XL827-AM, 8xSFP+Default ID_EEPROM is for HSIL

乙太網模組 COM_HPC Mezzanine card with Intel C827-IM, 2x QSFP28

記憶體模組

開發板及套件 - ARM QSEVEN REFERENCE STARTER KIT

電源管理 IC 開發工具 SMART BATTERY MANAGE KIT FOR COM EXPRESS

模組配件 COM-HPC Client ATX carrier board suitable for congatec COM-HPC modules with Size A,B and C- GATX

電腦模組 - COM COM Express Type 7 Basic module based on Intel Xeon D-1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40 C to 80 C.

電腦模組 - COM COM Express Type 7 Basic module based on Intel Xeon D-1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0 C to 60 C.

電腦模組 - COM COM Express Type 7 Basic module based on Intel Xeon D-1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40 C to 85 C. 4x SODIMM sockets.